Tape for Semiconductor Process

Tape for Semiconductor Process Market Outlook

The global Semiconductor Process Tapes market is anticipated to reach approximately USD 1.2 billion by 2035, growing at a robust CAGR of around 6.5% during the forecast period from 2025 to 2035. This growth can be attributed to the increasing demand for semiconductors across various industries, including consumer electronics, automotive, and telecommunications. The rapid advancements in technology, the proliferation of IoT devices, and the rising requirements for miniaturization and improved performance are significant factors driving the demand for semiconductor process tapes. Additionally, the global push towards electric vehicles and renewable energy solutions is further fueling the growth of this market. As manufacturers strive for enhanced efficiency and productivity in semiconductor fabrication processes, the adoption of specialized tapes is becoming essential.

Growth Factor of the Market

The Semiconductor Process Tapes market is experiencing substantial growth due to several factors that drive demand across industries. First, the ongoing advancements in semiconductor manufacturing technologies are leading to an increased need for high-quality process tapes that can withstand rigorous conditions such as extreme temperatures and chemical exposure. Second, the automotive industry's shift towards electric vehicles is creating new requirements for efficient semiconductor packaging and bonding processes, thus boosting the demand for specialized tapes. Third, the expansion of the consumer electronics sector, fueled by the rise of smartphones, tablets, and wearable devices, is further driving the market. Moreover, the trend towards the miniaturization of electronic components is creating a need for precision in semiconductor manufacturing, which can be supported by the use of advanced process tapes. Lastly, the growing trend of automation in manufacturing processes is also leading to increased investments in high-performance materials, including semiconductor process tapes.

Key Highlights of the Market

• The semiconductor process tapes market is projected to grow with a CAGR of 6.5% from 2025 to 2035.
• Asia Pacific is expected to dominate the market due to high semiconductor manufacturing activities in countries like China, Taiwan, and South Korea.
• Adhesive tapes are anticipated to hold the largest market share among product types, owing to their versatility and effectiveness in various applications.
• The rapid adoption of electric vehicles is significantly influencing the demand for semiconductor process tapes across the automotive sector.
• Increasing investments in research and development for innovative semiconductor materials are expected to enhance market growth.

By Product Type

Adhesive Tapes :

Adhesive tapes are anticipated to hold the largest segment in the Semiconductor Process Tapes market. These tapes are designed to provide a strong bond while maintaining the integrity of the semiconductor materials during the manufacturing and processing phases. Their ability to withstand high temperatures and chemical exposure makes them suitable for various applications, including wafer dicing and die attach processes. The increasing demand for reliable and efficient bonding solutions in semiconductor fabrication has propelled the growth of this segment. Moreover, advancements in adhesive technology, such as the development of high-performance adhesives that cure quickly and provide excellent adhesion, are expected to further enhance the segment's attractiveness.

Non-adhesive Tapes :

Non-adhesive tapes are specifically tailored for applications where adhesive residues can pose significant issues. These tapes are commonly used for surface protection, where they act as a barrier against contaminants and scratches during the semiconductor manufacturing process. As manufacturers seek to reduce the risk of contamination in their processes, the adoption of non-adhesive tapes is expected to gain momentum. Their ease of use and ability to be applied and removed without leaving residues make them an attractive option for manufacturers wanting to maintain high cleanliness standards in their production environments.

UV-curable Tapes :

UV-curable tapes have grown in popularity due to their unique properties, which allow them to be cured rapidly under UV light. This characteristic makes them ideal for applications requiring quick processing without compromising on performance. The ability of UV-curable tapes to provide excellent adhesion and durability makes them suitable for die attach and wire bonding applications. As semiconductor manufacturers continue to prioritize efficiency and speed in their processes, the demand for UV-curable tapes is anticipated to rise significantly, contributing positively to the overall growth of the semiconductor process tapes market.

High-temperature Tapes :

High-temperature tapes are engineered to withstand extreme temperatures often encountered in semiconductor manufacturing processes. These tapes are critical in applications such as backgrinding, where precision and temperature resistance are paramount. The demand for high-temperature tapes is expected to increase as semiconductor devices become more compact and require enhanced thermal management solutions. Their ability to maintain performance under high temperatures, in addition to their strong adhesion properties, positions them as a vital component in the semiconductor manufacturing value chain.

Low-tack Tapes :

Low-tack tapes are designed for applications where temporary adhesion is required without leaving residues upon removal. These tapes are particularly useful in processes where frequent adjustments or repositioning of components is necessary, such as in surface protection applications. The growing focus on reducing the risk of contamination and damage during semiconductor manufacturing processes is driving the adoption of low-tack tapes. Their ability to provide adequate protection without compromising the underlying surfaces makes them an essential choice for many manufacturers, thereby contributing to their increasing market share.

By Application

Wafer Dicing :

Wafer dicing is a critical application in the semiconductor manufacturing process, where individual chips are separated from a larger wafer. The use of semiconductor process tapes in this application helps to secure the wafer during the cutting process, preventing any damage or chipping. As the demand for smaller and more powerful semiconductor devices continues to rise, the wafer dicing process is becoming increasingly precise, necessitating high-quality tapes that can withstand the rigors of this application. Consequently, the wafer dicing segment is poised for considerable growth as innovations in semiconductor technology push manufacturers to adopt advanced materials.

Backgrinding :

Backgrinding is another essential application in semiconductor fabrication, where the wafer's back surface is polished to achieve the desired thickness. The use of specialized process tapes during backgrinding improves efficiency and prevents the wafer from cracking or breaking. As semiconductor manufacturers strive for thinner and lighter chips without compromising performance, the demand for effective backgrinding solutions, including high-performance process tapes, is expected to rise significantly in the coming years. This trend will likely contribute to the growth of the backgrinding segment within the semiconductor process tapes market.

Die Attach :

Die attach applications involve securely bonding the semiconductor die to the substrate or package. The use of process tapes in die attach applications ensures accurate positioning and reduces the risk of contamination during the bonding process. With the increasing complexity of semiconductor packaging and the demand for high-performance devices, the die attach segment is projected to experience significant growth. The need for reliable and efficient bonding solutions is driving manufacturers to seek high-quality tapes that can meet the stringent requirements of this application.

Wire Bonding :

Wire bonding is a technique used to connect the semiconductor chip to the package leads. The use of process tapes in wire bonding applications helps secure the wires and provides a stable environment, ensuring quality connections. As the semiconductor industry moves towards higher frequency and performance requirements, the demand for reliable wire bonding solutions is increasing. The growth of the wire bonding segment is driven by the need for improved efficiency and reliability in semiconductor packaging processes, positioning it as a key area for market expansion.

Surface Protection :

Surface protection is crucial in semiconductor manufacturing, as the components are often sensitive to dust, moisture, and other contaminants. Semiconductor process tapes designed for surface protection create a barrier that safeguards the semiconductor devices throughout the manufacturing process. With growing concerns about contamination and damage to sensitive components, the surface protection application is expected to see substantial growth. The increasing emphasis on maintaining high cleanliness standards in manufacturing environments will significantly contribute to the demand for surface protection tapes.

By Distribution Channel

Direct Sales :

Direct sales channels are a significant segment in the Semiconductor Process Tapes market, as manufacturers often prefer purchasing directly from suppliers for better terms and pricing. This approach allows for close interaction between buyers and sellers, enabling suppliers to provide tailored solutions that meet specific customer requirements. Direct sales also facilitate faster response times and the ability to address any concerns promptly. As manufacturers look to optimize their purchasing processes, the direct sales channel is expected to maintain its prominence in the market.

Distributors :

Distributors play a crucial role in the Semiconductor Process Tapes market by acting as intermediaries between manufacturers and end-users. They provide a wide range of products from different suppliers, allowing customers to access various options and make informed purchasing decisions. Additionally, distributors often offer value-added services, such as technical support and product training, enhancing their attractiveness to manufacturers. As the demand for semiconductor process tapes grows, the role of distributors is expected to become increasingly important in ensuring a steady supply to end-users across various industries.

Online Retailers :

The rise of e-commerce has significantly impacted the Semiconductor Process Tapes market, with online retailers becoming an essential distribution channel. The convenience and accessibility of online platforms enable customers to browse a wide selection of products, compare prices, and place orders from anywhere in the world. This shift to online purchasing is particularly appealing to small and medium-sized enterprises that may not have the resources to engage in direct negotiations with suppliers. As more manufacturers embrace digital transformation, the online retail segment is predicted to experience substantial growth in the coming years, contributing to the overall expansion of the semiconductor process tapes market.

By Material Type

Polyimide :

Polyimide is a widely used material in the Semiconductor Process Tapes market due to its excellent thermal and chemical resistance properties. This material is particularly favored in applications requiring high-performance solutions that can withstand extreme temperatures and harsh environments. Polyimide tapes are often utilized in processes such as wafer dicing and backgrinding, where their ability to maintain integrity and adhesion under challenging conditions is crucial. The growing demand for semiconductors in various industries is expected to drive the increased adoption of polyimide tapes, making them a key player in the market.

Polyester :

Polyester tapes are gaining traction in the Semiconductor Process Tapes market due to their versatility and cost-effectiveness. These tapes are often used in applications requiring good adhesion and moderate temperature resistance. While they may not withstand as high temperatures as polyimide tapes, polyester tapes provide a reliable solution for many semiconductor manufacturing processes. As manufacturers continue to seek out cost-efficient alternatives without compromising on quality, the demand for polyester tapes is anticipated to rise, contributing positively to the overall market growth.

Polyethylene :

Polyethylene tapes have found their niche in the Semiconductor Process Tapes market, primarily due to their excellent moisture resistance and flexibility. These tapes are commonly used in applications such as surface protection, where the need for a lightweight and easy-to-handle material is essential. The adaptability of polyethylene tapes in various manufacturing environments makes them an appealing choice for manufacturers seeking effective surface protection solutions. As the semiconductor industry looks to maintain high cleanliness standards, the demand for polyethylene tapes is expected to grow steadily.

PVC :

PVC (Polyvinyl Chloride) tapes are recognized for their durability and resistance to chemicals. In the Semiconductor Process Tapes market, these tapes are employed in various applications where robust protection is required. PVC tapes are particularly valuable in environments where exposure to solvents, oils, and other harsh chemicals is common. As semiconductor fabrication processes become increasingly complex, the demand for reliable and resilient materials like PVC is expected to rise, contributing to the overall growth of the market.

PTFE :

PTFE (Polytetrafluoroethylene) is known for its unique non-stick properties and high-temperature resistance, making it an ideal material for certain applications in the Semiconductor Process Tapes market. PTFE tapes are particularly useful in processes where low friction and chemical resistance are paramount, such as in high-temperature applications. The increasing focus on efficiency and performance in semiconductor manufacturing is expected to drive the adoption of PTFE tapes, as manufacturers seek advanced materials that can meet stringent requirements while enhancing operational effectiveness.

By Region

The Semiconductor Process Tapes market is experiencing varied growth across different regions, primarily driven by the concentration of semiconductor manufacturing activities. North America and Asia Pacific are currently leading the market in terms of revenue, with Asia Pacific expected to maintain its dominance due to high semiconductor production capabilities in countries like China, Taiwan, and South Korea. The region is projected to account for approximately 45% of the total market share by 2035, growing at a CAGR of 7% during the forecast period. The increasing investments in technology and the demand for innovative semiconductor solutions will continue to propel the growth of the market in Asia Pacific.

In North America, the Semiconductor Process Tapes market is also witnessing significant growth, driven by the presence of leading semiconductor companies and advanced technological research in the United States. This region is expected to hold a market share of around 25% by 2035, with a CAGR of 5.5%. Europe follows closely, with a focus on enhancing semiconductor production capabilities and supporting technological advancements. Latin America and the Middle East & Africa are projected to contribute smaller shares to the market, but the growth potential in these regions cannot be underestimated as they continue to develop their semiconductor industries and increase investments in manufacturing capabilities.

Opportunities

The Semiconductor Process Tapes market presents several opportunities for growth, especially as the demand for advanced technologies continues to rise. One notable opportunity lies in the increasing adoption of electric vehicles, which require efficient semiconductor solutions for enhanced performance and energy management. As automotive manufacturers seek to develop more sophisticated electronic systems, the need for high-quality process tapes is expected to escalate. Additionally, the ongoing trend towards miniaturization in consumer electronics means that manufacturers will increasingly require specialized tapes to ensure the reliability and performance of compact semiconductor devices. This demand presents a significant opportunity for both established players and new entrants in the semiconductor process tapes market to innovate and deliver tailored solutions.

Furthermore, the global emphasis on sustainability and eco-friendly manufacturing practices is leading to a growing interest in developing environmentally friendly semiconductor process tapes. Manufacturers focusing on sustainable materials and production methods are likely to attract attention from discerning customers who prioritize eco-conscious solutions. As such, investing in research and development to create green alternatives to traditional process tapes can open new avenues for growth. Additionally, with the increasing integration of artificial intelligence and automation in semiconductor manufacturing, there is a considerable opportunity for process tape manufacturers to collaborate with technology providers to develop advanced solutions that enhance efficiency and reduce waste in semiconductor fabrication processes.

Threats

Despite the promising growth trajectory of the Semiconductor Process Tapes market, several threats could hinder its progress. One of the primary concerns is the volatile nature of raw material prices, which can significantly impact manufacturing costs and profit margins for tape producers. Fluctuations in the prices of materials such as polyimide and polyester can lead to unpredictability in the market, making it challenging for manufacturers to maintain competitive pricing while ensuring product quality. Additionally, the semiconductor industry is characterized by rapid technological advancements, and companies that fail to keep pace with innovation may find themselves at a disadvantage. The emergence of new materials and processes can render existing tapes obsolete or less effective, necessitating continuous investment in research and development to stay relevant and meet the evolving demands of the industry.

Moreover, increasing competition from low-cost manufacturers, particularly in emerging markets, poses a significant threat to established players in the Semiconductor Process Tapes market. These competitors may offer cheaper alternatives that can attract price-sensitive customers, potentially eroding market share for established brands. Furthermore, the growing trend of consolidation within the semiconductor industry may result in larger companies seeking to develop in-house solutions, thereby reducing their reliance on external process tape suppliers. This shift could lead to decreased demand for semiconductor process tapes, presenting a challenge for market participants to maintain their customer base and revenue streams.

Competitor Outlook

• 3M Company
• DuPont de Nemours, Inc.
• Nitto Denko Corporation
• Tesa SE
• Saint-Gobain
• Adhesive Applications, Inc.
• Intertape Polymer Group Inc.
• Scotch Tape (subsidy of 3M)
• LINTEC Corporation
• FLEXcon Company, Inc.
• Shurtape Technologies, LLC
• Dow Inc.
• Henkel AG & Co. KGaA
• Asahi Kasei Corporation
• Elastomer Solutions
• AVERY DENNISON CORPORATION

The competitive landscape of the Semiconductor Process Tapes market is characterized by the presence of several key players that dominate the sector. These companies are continually innovating and expanding their product offerings to cater to the diverse needs of semiconductor manufacturers. The competitive nature of the market often leads to strategic collaborations and partnerships aimed at enhancing technological capabilities and broadening market reach. For instance, 3M Company and DuPont de Nemours, Inc. are known for their extensive research and development efforts, enabling them to introduce cutting-edge products that meet the stringent demands of semiconductor applications. Additionally, many of these companies are increasingly focusing on sustainability, aiming to reduce environmental impact through eco-friendly manufacturing practices and materials.

3M Company stands out as a leader in the Semiconductor Process Tapes market, leveraging its extensive portfolio of products and strong brand reputation. The company specializes in adhesive solutions that cater to various applications, including wafer dicing and die attach. Its commitment to innovation is evident in its continuous investment in research and development, resulting in high-performance process tapes that meet the evolving needs of the semiconductor industry. Likewise, DuPont de Nemours, Inc. is recognized for its advanced materials and adhesive technologies, which are essential in semiconductor fabrication processes. The company's focus on quality and reliability has made it a preferred choice for many semiconductor manufacturers, further solidifying its position in the market.

Another notable player, Nitto Denko Corporation, has established a strong foothold in the Semiconductor Process Tapes market, thanks to its innovative product offerings and commitment to customer satisfaction. The company specializes in creating adhesive tapes that provide excellent performance in high-temperature applications, making it an ideal partner for semiconductor manufacturers. Tesa SE and Saint-Gobain are also key competitors, each known for their specialized products that cater to various aspects of semiconductor manufacturing. These companies continue to invest in expanding their global presence and enhancing their technological capabilities to meet the growing demand for advanced semiconductor process tapes.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 Tesa SE
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Dow Inc.
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 3M Company
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Saint-Gobain
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 LINTEC Corporation
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Elastomer Solutions
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Henkel AG & Co. KGaA
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 FLEXcon Company, Inc.
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 Asahi Kasei Corporation
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 DuPont de Nemours, Inc.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Nitto Denko Corporation
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 AVERY DENNISON CORPORATION
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Shurtape Technologies, LLC
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Adhesive Applications, Inc.
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Scotch Tape (subsidy of 3M)
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis
  • 5.16 Intertape Polymer Group Inc.
    • 5.16.1 Business Overview
    • 5.16.2 Products & Services
    • 5.16.3 Financials
    • 5.16.4 Recent Developments
    • 5.16.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 Tape for Semiconductor Process Market, By Application
    • 6.1.1 Wafer Dicing
    • 6.1.2 Backgrinding
    • 6.1.3 Die Attach
    • 6.1.4 Wire Bonding
    • 6.1.5 Surface Protection
  • 6.2 Tape for Semiconductor Process Market, By Product Type
    • 6.2.1 Adhesive Tapes
    • 6.2.2 Non-adhesive Tapes
    • 6.2.3 UV-curable Tapes
    • 6.2.4 High-temperature Tapes
    • 6.2.5 Low-tack Tapes
  • 6.3 Tape for Semiconductor Process Market, By Material Type
    • 6.3.1 Polyimide
    • 6.3.2 Polyester
    • 6.3.3 Polyethylene
    • 6.3.4 PVC
    • 6.3.5 PTFE
  • 6.4 Tape for Semiconductor Process Market, By Distribution Channel
    • 6.4.1 Direct Sales
    • 6.4.2 Distributors
    • 6.4.3 Online Retailers

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Middle East & Africa - Market Analysis
    • 10.5.1 By Country
      • 10.5.1.1 Middle East
      • 10.5.1.2 Africa
  • 10.6 Tape for Semiconductor Process Market by Region

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global Tape for Semiconductor Process market is categorized based on

By Product Type

• Adhesive Tapes
• Non-adhesive Tapes
• UV-curable Tapes
• High-temperature Tapes
• Low-tack Tapes

By Application

• Wafer Dicing
• Backgrinding
• Die Attach
• Wire Bonding
• Surface Protection

By Distribution Channel

• Direct Sales
• Distributors
• Online Retailers

By Material Type

• Polyimide
• Polyester
• Polyethylene
• PVC
• PTFE

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• 3M Company
• DuPont de Nemours, Inc.
• Nitto Denko Corporation
• Tesa SE
• Saint-Gobain
• Adhesive Applications, Inc.
• Intertape Polymer Group Inc.
• Scotch Tape (subsidy of 3M)
• LINTEC Corporation
• FLEXcon Company, Inc.
• Shurtape Technologies, LLC
• Dow Inc.
• Henkel AG & Co. KGaA
• Asahi Kasei Corporation
• Elastomer Solutions
• AVERY DENNISON CORPORATION