Thermal Interface Materials

Thermal Interface Materials Market Outlook

The global Thermal Interface Materials (TIM) market is expected to reach USD 4.5 billion by 2035, growing at a CAGR of 7.2% during the forecast period from 2025 to 2035. This significant growth is driven by the increasing demand for high-performance electronics, particularly in sectors such as consumer electronics, automotive, and industrial machinery. The rise of innovative technologies, including electric vehicles and advanced computing systems, has further propelled the demand for thermal management solutions. Additionally, stringent regulations concerning energy efficiency and the growing need for sustainable materials are fostering advancements in the thermal interface materials sector. Moreover, the increased focus on miniaturization in electronic components amplifies the importance of effective thermal management, thus catalyzing market growth.

Growth Factor of the Market

The growth of the thermal interface materials market is primarily attributed to the burgeoning electronics sector, which demands efficient heat dissipation solutions for components operating at high power levels. The proliferation of electric vehicles is another crucial factor, as these vehicles require advanced thermal management systems to ensure optimal battery performance and longevity. Furthermore, the rise of renewable energy technologies, such as solar inverters and energy storage systems, necessitates reliable thermal interface materials to maintain operational efficacy and safety. Innovations in material science are also contributing to market expansion, as manufacturers develop new compounds with enhanced thermal conductivity and durability. The increasing implementation of automation in industries further propels the demand for thermal management solutions, driving the market towards new heights.

Key Highlights of the Market

• The TIM market is projected to grow at a CAGR of 7.2% from 2025 to 2035.
• Significant demand from the automotive sector, particularly for electric vehicles, is a key market driver.
• Technological advancements in thermal materials enhance product performance and reliability.
• Greater focus on energy-efficient systems across various industries is boosting market growth.
• Asia Pacific is expected to dominate the market due to robust manufacturing and electronics sectors.

By Product Type

Greases:

Greases are a popular category of thermal interface materials primarily used for their excellent thermal conductivity and ease of application. These materials are particularly effective in filling microscopic gaps between surfaces, ensuring efficient heat transfer. The increasing integration of high-performance electronic components necessitates advanced thermal greases that can withstand higher temperatures while maintaining their properties. Greases are commonly employed in various applications, including automotive, consumer electronics, and industrial machinery, where they provide effective thermal management solutions. The growing demand for lightweight and compact electronic devices is pushing the development of advanced grease formulations that offer superior performance in a smaller footprint.

Adhesives:

Adhesives serve a dual purpose in thermal management by providing both bonding and thermal conductivity. They are extensively used in assembling electronic components where the prevention of air gaps is crucial for optimal heat dissipation. The rise of miniaturized electronic devices necessitates adhesives that can withstand thermal cycling while maintaining their adhesive properties. These materials are also critical in applications requiring high reliability, such as in the automotive and aerospace sectors. The versatility of thermal adhesives allows for their use across various substrates, enhancing design flexibility and performance in demanding applications. Innovations in adhesive formulations are driving the market, with manufacturers focusing on developing products that offer enhanced durability and thermal performance.

Tapes:

Thermal interface tapes are an essential category in the thermal management landscape, known for their ease of application and ability to conform to irregular surfaces. These tapes typically consist of a substrate coated with a thermally conductive material, providing a reliable interface for heat transfer. They are particularly beneficial in applications where traditional methods such as greases or adhesives may be less effective. The growing trend toward automated assembly processes in electronics manufacturing is enhancing the demand for thermal tapes, as they simplify the handling and application processes. Additionally, the versatility of thermal tapes expands their applicability across various industries, including consumer electronics, automotive, and medical devices.

Phase Change Materials:

Phase Change Materials (PCMs) are innovative thermal interface materials that absorb, store, and release heat while undergoing a phase change. These materials have gained significant traction in applications requiring efficient heat management, especially in electronic devices that generate substantial heat during operation. PCMs are particularly beneficial in environments with fluctuating temperatures, as they can maintain temperature stability by absorbing excess heat. Their unique properties make them suitable for use in a wide range of applications, from consumer electronics to industrial machinery and telecommunications. The increasing demand for energy-efficient solutions is driving research and development in PCMs, leading to advancements that further enhance their thermal performance and expand their market potential.

Gap Fillers:

Gap fillers play a crucial role in the thermal interface materials market, designed to fill air gaps between surfaces to ensure efficient thermal transfer. These materials are particularly important in applications where traditional methods may fail to provide adequate contact. Commonly used in high-performance electronics, gap fillers are characterized by their excellent thermal conductivity and ability to conform to uneven surfaces. As the demand for compact and powerful electronic devices continues to grow, the importance of effective thermal management solutions like gap fillers has surged. The versatility and reliability of gap fillers make them essential for various applications across sectors such as automotive, consumer electronics, and telecommunications, where managing heat dissipation is critical for performance and longevity.

By Application

Automotive Electronics:

The automotive electronics segment is witnessing significant growth due to the increasing integration of advanced technologies in vehicles, including electric and hybrid systems. Efficient thermal management is crucial for these systems, as they generate substantial heat during operation. Thermal interface materials are essential for maintaining optimal function and longevity of automotive components such as batteries, power electronics, and sensors. The shift towards electric vehicles (EVs) particularly drives the demand for high-performance TIMs that can withstand extreme temperatures and ensure safety and reliability. The ongoing advancements in automotive technology and the focus on enhancing fuel efficiency and performance are expected to further fuel market growth in this segment.

Industrial Machinery:

The industrial machinery sector is another significant application area for thermal interface materials, where effective heat management is vital for the operational efficiency of machinery. Equipment such as motors, generators, and pumps generates heat that can affect performance and longevity if not properly managed. TIMs are employed to ensure efficient thermal conduction, helping to dissipate heat and maintain optimal operating temperatures. The increasing emphasis on operational efficiency and equipment reliability in industrial settings is driving the demand for effective thermal interface materials. Moreover, the trend of automation and smart manufacturing is expected to further bolster the growth of TIMs in industrial machinery applications.

Consumer Electronics:

Consumer electronics is one of the most dynamic segments for thermal interface materials, driven by the constant demand for high-performance devices. The rapid advancement of electronic gadgets such as smartphones, laptops, and gaming consoles necessitates efficient heat management solutions to ensure performance and user comfort. Thermal interface materials play a crucial role in dissipating heat generated by densely packed electronic components, preventing overheating and improving reliability. As manufacturers strive for thinner and lighter devices with increased processing power, the importance of effective TIMs becomes even more pronounced. The growing trend of miniaturization in consumer electronics is expected to further enhance the demand for advanced thermal interface materials in this segment.

Telecom Equipment:

Telecommunication equipment, including servers and networking devices, requires efficient thermal management to ensure reliability and performance. As data centers expand and the demand for high-speed internet increases, the need for effective thermal interface materials becomes critical. TIMs are utilized in various components within telecommunications equipment, providing excellent thermal conduction and preventing overheating in high-performance systems. The ongoing evolution of telecom technology, including the rollout of 5G networks, is further driving demand for advanced thermal solutions that can withstand increased operational demands. Additionally, the push for energy-efficient solutions in telecommunication infrastructure is bolstering the market for thermal interface materials.

Medical Devices:

The medical devices sector is increasingly recognizing the importance of effective thermal management, especially in devices that generate heat during operation. Thermal interface materials are utilized in various medical equipment, including imaging systems, diagnostic devices, and therapeutic equipment, where overheating can compromise performance and safety. The need for high reliability and performance in medical technologies drives the demand for TIMs that offer excellent thermal conduction and stability under varying operating conditions. As the healthcare industry continues to innovate and adopt advanced technologies, the role of thermal interface materials will become more prominent, enhancing the operational efficacy and reliability of medical devices.

By Distribution Channel

Direct Sales:

Direct sales serve as a crucial distribution channel for thermal interface materials, allowing manufacturers to engage directly with customers and provide tailored solutions. This approach enables manufacturers to maintain closer relationships with their clients, ensuring better understanding of specific needs and requirements. Direct sales often facilitate quicker response times and customized support, which can be a significant advantage in industries requiring specialized thermal management solutions. Additionally, manufacturers can provide technical support and advice directly to customers, enhancing the overall service experience. This channel is particularly beneficial for companies focusing on high-end applications that demand specific thermal properties and performance standards.

Distributors:

Distribution through third-party distributors is another vital channel for thermal interface materials, providing manufacturers with access to broader markets and customer bases. Distributors often possess extensive knowledge of local markets and established relationships with various industries, enabling them to effectively promote and sell TIM products. This distribution model allows manufacturers to leverage the expertise of distributors in navigating regulatory requirements and market dynamics in different regions. Moreover, distributors can offer a diverse range of products, allowing customers to find the right thermal interface material for their specific applications. The growing complexity of modern supply chains further emphasizes the importance of distribution partnerships in ensuring timely availability and accessibility of thermal interface materials.

By Material Type

Silicone:

Silicone-based thermal interface materials are widely used due to their excellent thermal conductivity, flexibility, and resistance to extreme temperatures. These materials are particularly effective in applications requiring high thermal performance and reliability, making them suitable for various sectors including automotive, consumer electronics, and industrial machinery. The unique properties of silicone allow for application in diverse environments, ensuring optimal thermal management even under challenging conditions. Additionally, the adaptability of silicone formulations enables manufacturers to produce tailored solutions that meet specific customer requirements. As the demand for high-performance electronic components continues to rise, the relevance of silicone in thermal interface materials remains strong.

Epoxy:

Epoxy thermal interface materials are known for their strong bonding properties and high thermal conductivity, making them ideal for applications where durability and performance are critical. These materials are commonly used in industries such as automotive and aerospace, where they ensure effective heat transfer between components. The popularity of epoxies in the TIM sector stems from their ability to withstand high temperatures and mechanical stress, making them suitable for demanding applications. Moreover, innovations in epoxy formulations are driving the development of products that offer enhanced thermal performance and ease of application, further solidifying their position in the market.

Polyimide:

Polyimide-based thermal interface materials are gaining traction due to their excellent thermal stability and chemical resistance. These materials are particularly advantageous in high-temperature applications, where conventional TIMs may fail to perform adequately. Polyimide is commonly used in aerospace, electronics, and telecommunications, where its unique properties help manage heat effectively. As industries continue to emphasize reliability and performance, the demand for polyimide in thermal interface materials is expected to grow. Additionally, advancements in manufacturing processes are enabling the production of polyimide TIMs with enhanced thermal conductivity and application versatility, driving market expansion.

Acrylic:

Acrylic thermal interface materials are recognized for their ease of application and versatility, making them suitable for a wide range of applications. These materials typically offer good thermal conductivity while providing sufficient flexibility to conform to various surfaces. Acrylic TIMs are commonly employed in consumer electronics and industrial machinery, where effective heat dissipation is essential. The growing focus on sustainability and eco-friendly materials is also propelling the development of acrylic formulations that meet environmental standards. As manufacturers continue to innovate in this area, the demand for acrylic thermal interface materials is expected to increase across various sectors.

Metal-Based:

Metal-based thermal interface materials are renowned for their superior thermal conductivity and ability to manage heat effectively in high-performance applications. These materials are particularly beneficial in sectors such as automotive and industrial machinery, where efficient thermal management is critical for operational success. The use of metals in TIMs enables effective heat transfer between components, enhancing overall performance and reliability. As the demand for high-power electronic devices continues to rise, metal-based thermal interface materials are becoming increasingly relevant. Innovations in metal formulations and composites are also driving market growth, as manufacturers develop products that offer enhanced thermal performance and durability.

By Region

The North American region is expected to hold a significant share of the thermal interface materials market, accounting for approximately 30% of the global market share by 2035. This dominance is attributed to the presence of established automotive and electronics industries, coupled with continuous advancements in technology. The increasing adoption of electric vehicles and high-performance computing systems in the region further fuels the demand for effective thermal management solutions. Furthermore, stringent regulations regarding energy efficiency in the automotive and electronics sectors are driving innovations in thermal interface materials, positioning North America as a key player in the market. The region is anticipated to experience a CAGR of 6.8% during the forecast period, reflecting robust growth in demand for TIMs.

Europe is also a prominent region in the thermal interface materials market, primarily driven by the automotive sector’s shift towards electrification and the increasing emphasis on energy-efficient technologies. The region is home to several leading automotive manufacturers and technology companies, which significantly contributes to the demand for thermal interface materials. By 2035, Europe is projected to account for approximately 25% of the global market. The region's focus on sustainability and reducing carbon emissions is further accelerating the adoption of advanced thermal management solutions in various industries. The growth in the European market is expected to be supported by various government initiatives aimed at promoting the use of eco-friendly materials and technologies.

Opportunities

The thermal interface materials market is poised for significant opportunities driven by technological advancements and innovation across various industries. The increasing integration of advanced thermal management solutions in emerging technologies, such as electric vehicles and renewable energy systems, presents a substantial growth avenue for TIM manufacturers. As industries strive to enhance energy efficiency and performance, the demand for high-quality thermal interface materials that offer superior thermal conductivity and durability is expected to rise. Moreover, the ongoing trend towards miniaturization in electronics creates opportunities for the development of compact and efficient TIMs that can effectively manage heat in smaller devices. Manufacturers focusing on research and development to create innovative thermal solutions stand to gain a competitive edge in the rapidly evolving market.

Additionally, the growing emphasis on sustainability and eco-friendly products is opening new doors for thermal interface materials manufacturers. Consumers and businesses alike are increasingly prioritizing environmentally friendly solutions, prompting manufacturers to explore sustainable materials and production processes. The potential for developing bio-based and recyclable thermal interface materials offers a unique opportunity for companies to differentiate themselves in the market while catering to the rising demand for sustainable options. As regulations become more stringent regarding environmental impact, TIM producers that innovate in this area are likely to capture new market segments and foster long-term growth.

Threats

Despite the promising growth potential, the thermal interface materials market faces several threats that could hinder its expansion. One significant challenge is the fluctuating prices of raw materials, which can impact production costs and, consequently, the pricing of thermal interface materials. As the market is highly sensitive to cost fluctuations, manufacturers may face difficulties in maintaining competitive pricing while ensuring product quality. Additionally, the rapid pace of technological advancements in alternative thermal management solutions, such as liquid cooling systems, poses a threat to traditional thermal interface materials. The emergence of innovative cooling technologies may result in decreased demand for TIMs, impacting market growth adversely. Manufacturers must remain vigilant and adaptable to changing market dynamics to mitigate these risks effectively.

Another potential threat to the thermal interface materials market is the increasing competition from low-cost manufacturers, particularly in regions with lower production costs. These competitors may offer cheaper products, which could lead to price wars and reduced profit margins for established manufacturers. Additionally, the influx of low-quality TIMs may compromise performance and reliability, resulting in customer dissatisfaction and damage to brand reputation. To counter this threat, manufacturers need to emphasize product quality, performance, and customer support, ensuring they differentiate themselves from low-cost competitors. Continuous innovation and investment in research and development will be essential for market players to maintain their competitive edge in a crowded and evolving landscape.

Competitor Outlook

• 3M Company
• Laird Performance Materials
• Henkel AG & Co. KGaA
• Dow Inc.
• Momentive Performance Materials Inc.
• Thermal Interface Products
• Chomerics (Parker Hannifin Corporation)
• Fujipoly America Corp.
• Shenzhen Xinhong Technology Co., Ltd.
• Panasonic Corporation
• SUMITOMO ELECTRIC INDUSTRIES, LTD.
• Electrolube
• Masterbond Inc.
• Gap Pad (Bergquist)
• Shenzhen Yidong Technology Co., Ltd.

The competitive landscape in the thermal interface materials market is characterized by a diverse array of players, ranging from established multinational corporations to specialized manufacturers. Major companies such as 3M Company, Laird Performance Materials, and Henkel AG are leading the charge with their extensive product portfolios and commitment to research and development. These companies leverage their technological expertise and innovative capabilities to deliver high-performance thermal interface materials tailored to meet the demands of various industries. The competition is intensified by the increasing focus on sustainability and the development of eco-friendly products, prompting manufacturers to explore alternative materials and production methods. As a result, there is a continual push towards enhancing product performance while addressing the environmental concerns of consumers and businesses alike.

Furthermore, the presence of regional players, such as Shenzhen Xinhong Technology Co., Ltd. and Shenzhen Yidong Technology Co., Ltd., adds another layer of complexity to the competitive landscape. These companies often focus on specific market niches and cater to local demands, enabling them to capture market share in regions with distinct requirements. The ability of these players to quickly adapt to market changes and offer competitive pricing allows them to thrive in a crowded marketplace. Additionally, partnerships and collaborations among manufacturers, distributors, and research institutions are becoming increasingly common, fostering innovation and driving advancements in thermal interface material technologies.

Companies like Dow Inc. and Momentive Performance Materials Inc. are emphasizing the importance of developing advanced materials that cater to high-performance applications, particularly in sectors such as automotive and aerospace. Their research and development efforts focus on creating TIMs with superior thermal conductivity, durability, and ease of application. Such innovations not only enhance the performance of electronic devices but also contribute to energy efficiency and sustainability goals. As the competition continues to evolve, successful players will be those who can balance technical excellence with customer satisfaction, establishing themselves as trusted partners in the thermal management solutions market.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 Dow Inc.
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 3M Company
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Electrolube
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Masterbond Inc.
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 Gap Pad (Bergquist)
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Henkel AG & Co. KGaA
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Panasonic Corporation
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Fujipoly America Corp.
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 Thermal Interface Products
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Laird Performance Materials
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 SUMITOMO ELECTRIC INDUSTRIES, LTD.
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Momentive Performance Materials Inc.
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Shenzhen Yidong Technology Co., Ltd.
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Shenzhen Xinhong Technology Co., Ltd.
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Chomerics (Parker Hannifin Corporation)
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 Thermal Interface Materials Market, By Application
    • 6.1.1 Automotive Electronics
    • 6.1.2 Industrial Machinery
    • 6.1.3 Consumer Electronics
    • 6.1.4 Telecom Equipment
    • 6.1.5 Medical Devices
  • 6.2 Thermal Interface Materials Market, By Product Type
    • 6.2.1 Greases
    • 6.2.2 Adhesives
    • 6.2.3 Tapes
    • 6.2.4 Phase Change Materials
    • 6.2.5 Gap Fillers
  • 6.3 Thermal Interface Materials Market, By Material Type
    • 6.3.1 Silicone
    • 6.3.2 Epoxy
    • 6.3.3 Polyimide
    • 6.3.4 Acrylic
    • 6.3.5 Metal-Based
  • 6.4 Thermal Interface Materials Market, By Distribution Channel
    • 6.4.1 Direct Sales
    • 6.4.2 Distributors

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Middle East & Africa - Market Analysis
    • 10.5.1 By Country
      • 10.5.1.1 Middle East
      • 10.5.1.2 Africa
  • 10.6 Thermal Interface Materials Market by Region

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global Thermal Interface Materials market is categorized based on

By Product Type

• Greases
• Adhesives
• Tapes
• Phase Change Materials
• Gap Fillers

By Application

• Automotive Electronics
• Industrial Machinery
• Consumer Electronics
• Telecom Equipment
• Medical Devices

By Distribution Channel

• Direct Sales
• Distributors

By Material Type

• Silicone
• Epoxy
• Polyimide
• Acrylic
• Metal-Based

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• 3M Company
• Laird Performance Materials
• Henkel AG & Co. KGaA
• Dow Inc.
• Momentive Performance Materials Inc.
• Thermal Interface Products
• Chomerics (Parker Hannifin Corporation)
• Fujipoly America Corp.
• Shenzhen Xinhong Technology Co., Ltd.
• Panasonic Corporation
• SUMITOMO ELECTRIC INDUSTRIES, LTD.
• Electrolube
• Masterbond Inc.
• Gap Pad (Bergquist)
• Shenzhen Yidong Technology Co., Ltd.