System in Package

System in Package Market Outlook

The global System in Package (SiP) market is projected to reach approximately USD 30 billion by 2035, expanding at a CAGR of around 12% during the forecast period of 2025 to 2035. The surge in demand for compact electronic devices that integrate multiple functions into a single package is one of the primary growth factors driving the SiP market. With the proliferation of consumer electronics, including smartphones and IoT devices, manufacturers are looking for efficient packaging solutions that enhance performance while saving space. Additionally, advancements in semiconductor technology and the increasing need for high-performance computing in various applications are further propelling the market forward. The rise of automation in industries like automotive and healthcare is also contributing to the increased adoption of SiP solutions, as these sectors demand more efficient and reliable electronic systems.

Growth Factor of the Market

A significant growth factor for the System in Package market is the rapid evolution of consumer electronics, leading to an increasing need for miniaturized solutions that deliver high functionality in limited space. This trend is particularly evident in smartphones, wearables, and other portable gadgets, where space is often at a premium. Furthermore, the growth of the Internet of Things (IoT) is driving demand for SiP solutions, as these devices require compact, integrated designs to support varied functions while maintaining energy efficiency. The automotive sector, with its growing need for advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems, is also boosting the adoption of SiP technologies. The transition toward electric vehicles (EVs) is another critical factor, as these vehicles rely heavily on sophisticated electronic components that can be effectively managed within a System in Package framework. Lastly, advancements in manufacturing processes and materials are enabling the development of more efficient SiP technologies, allowing for higher performance and better reliability.

Key Highlights of the Market

• The global System in Package market is projected to reach USD 30 billion by 2035.
• The CAGR for the market is expected to be around 12% from 2025 to 2035.
• Consumer electronics, including smartphones and wearables, are the largest application sector driving the market.
• Significant growth is observed in the automotive industry due to the demand for advanced electronic systems.
• Technological advancements and innovations in packaging materials are enhancing SiP functionalities and efficiency.

By Packaging Technology

2D IC Packaging:

2D IC Packaging has been a traditional approach in the semiconductor industry, focusing on the integration of multiple components on a single substrate. This technology enables manufacturers to create compact designs while ensuring adequate signal integrity and thermal management. The main advantage of 2D IC Packaging lies in its simplicity and cost-effectiveness, making it suitable for a wide range of applications. However, as the demand for higher performance and functionality increases, manufacturers are exploring advanced packaging solutions. Despite this, 2D IC remains dominant in the market due to its widespread use in consumer electronics and telecommunications, where performance-to-cost ratios are critical considerations.

2.5D IC Packaging:

2.5D IC Packaging represents a hybrid approach that combines elements of both 2D and 3D packaging technologies. This packaging type utilizes an interposer to connect multiple chips within a single package, providing a higher degree of integration while maintaining a relatively flat profile. The benefits of 2.5D IC Packaging include reduced interconnect lengths and improved electrical performance, making it an attractive option for high-performance computing and data center applications. This technology is particularly advantageous in scenarios where large die sizes are required, as it allows for efficient heat dissipation and lower power consumption. As such, the 2.5D IC Packaging segment is anticipated to see significant growth, driven by the increasing demands of advanced applications in AI and machine learning.

3D IC Packaging:

3D IC Packaging offers an innovative solution by stacking multiple silicon dies vertically, thereby reducing the footprint and enhancing performance. This approach allows for shorter interconnects and increased bandwidth, which is essential for applications requiring high-speed data processing. The technology is becoming increasingly relevant in sectors such as telecommunications and data centers, where performance and space efficiency are paramount. However, the complexity of 3D IC Packaging can lead to higher manufacturing costs and require careful thermal management. Despite these challenges, the segment is expected to grow significantly as more industries recognize the advantages of high density and performance in critical applications.

Fan-out WLP:

Fan-out Wafer Level Packaging (WLP) is an emerging technology that provides increased functionality while maintaining a compact size. This packaging method allows for a higher density of connections and improved thermal performance, making it ideal for consumer electronics and IoT devices. Fan-out WLP enables manufacturers to integrate multiple types of chips within a single package, offering designers the flexibility to create more complex systems in smaller footprints. The growth of the Internet of Things (IoT) and wearable technology is set to propel the demand for Fan-out WLP, as these applications benefit from the advantages of miniaturization and high performance. As a result, this segment of the market is expected to witness substantial growth over the forecast period.

Flip Chip:

Flip Chip technology is another advanced packaging solution that involves mounting chips face down on the substrate, allowing for direct electrical connections. This method enhances performance by reducing signal loss and improving thermal management. Flip Chip is particularly beneficial for high-speed applications, including telecommunications and computing, where performance is critical. The technology is increasingly favored in high-density interconnect applications, as it enables a compact design with fewer layers. The Flip Chip segment is anticipated to see significant growth as industries demand higher integration levels and better performance from their electronic components.

Others:

The "Others" category encompasses various emerging packaging technologies that are currently being developed and adopted in niche applications. These technologies may include advanced RF packaging, integrated passive devices, and novel packaging materials that enhance performance and reliability. As manufacturers seek to differentiate their products and create more sophisticated electronic systems, the demand for innovative packaging solutions in this category is expected to grow. While these technologies currently represent a smaller segment of the market, their potential for high performance and specialization in specific applications could lead to increased adoption in the coming years.

By Integration Type

SiP:

System in Package (SiP) technology integrates multiple components, such as passive and active devices, within a single package. This integration approach significantly reduces the footprint of electronic systems while enhancing performance, making it ideal for applications in consumer electronics, automotive, and healthcare. The SiP technology allows for the combination of various functionalities, such as processing, memory, and RF capabilities, which greatly benefits compact devices. As the demand for miniaturization and multi-functionality increases, the SiP segment is expected to witness substantial growth, driven by the ongoing technological advancements aimed at achieving higher integration levels.

SoC:

System on Chip (SoC) represents another significant integration type that combines all components of a computer or other electronic system onto a single chip. This technology is particularly valuable in applications requiring high performance and low power consumption, such as mobile devices, IoT, and automotive systems. SoCs enable manufacturers to streamline production and reduce costs while enhancing the overall performance of the final product. The increasing adoption of smart devices and connected technologies is expected to drive the demand for SoCs, making them an essential component of the System in Package market.

SiP with Processor:

SiP with Processor configurations are gaining traction in the market, providing an integrated solution that combines processing capabilities with various other components in a single package. This integration allows for superior performance in tasks that require significant computational power, such as in advanced mobile applications and IoT devices. The ability to deliver high performance while saving on space and reducing power consumption makes SiP with Processor an attractive option for manufacturers looking to create cutting-edge products. The growing trend of edge computing and real-time data processing is expected to further propel the growth of this segment in the coming years.

SoP:

System on Package (SoP) is designed to integrate various functionalities into a single package, including analog, digital, and RF components. This technology enables manufacturers to create highly integrated solutions that cater to specific application requirements. SoP is particularly beneficial in telecommunications, automotive, and consumer electronics, where compact designs and high performance are critical. As the demand for customized electronic solutions continues to rise, the SoP segment is set to experience considerable growth, driven by innovations in packaging technologies and the increasing need for integration across various applications.

By User Industry

Consumer Electronics:

The consumer electronics industry is one of the largest users of System in Package technologies, driven by the increasing demand for compact, high-performance devices. As electronic gadgets such as smartphones, wearables, and smart home devices continue to evolve, manufacturers are seeking innovative packaging solutions that allow for greater functionality within smaller footprints. SiP technologies facilitate the integration of multiple functions, such as processing, connectivity, and sensing, which is essential for the next generation of consumer electronics. The significant growth potential in this sector is boosted by the rising disposable income and technological advancements, leading to an expanding market for SiP solutions.

Telecommunications:

The telecommunications sector is experiencing a transformative phase, characterized by the proliferation of 5G technology and the increasing demand for high-speed connectivity. System in Package technologies are playing a critical role in enabling these advancements, as they provide the necessary integration of various components for efficient data processing and transmission. The ability to package multiple functionalities within a single solution helps telecom manufacturers create compact and efficient devices capable of handling higher data rates and improved connectivity. With the ongoing rollout of 5G infrastructure and the growing reliance on mobile communication, the telecommunications segment is poised for substantial growth in the SiP market.

Automotive:

The automotive industry is undergoing a significant transformation, with the increasing integration of advanced electronic systems in vehicles, including ADAS, infotainment, and electric vehicle (EV) technologies. System in Package solutions are essential in meeting the demands for high performance and reliability in these applications. SiP technologies enable manufacturers to create more compact and efficient electronic components that are critical for modern vehicles. As the automotive landscape shifts towards greater automation and electrification, the demand for SiP solutions is expected to grow rapidly, making this sector a key driver of market expansion.

Healthcare:

The healthcare industry is increasingly adopting advanced electronic solutions, particularly in medical devices and diagnostic equipment. System in Package technologies are instrumental in delivering the necessary miniaturization and integration required for portable and wearable health monitoring devices. SiP allows for the combination of various functionalities, including sensors, processing units, and communication interfaces, all within a compact package. The growing focus on telemedicine and personalized healthcare is further propelling the demand for SiP solutions, as manufacturers seek to develop innovative products that enhance patient care and improve health outcomes.

Others:

Besides consumer electronics, telecommunications, automotive, and healthcare, the System in Package market also caters to various other industries, including aerospace, industrial automation, and energy. These sectors are increasingly recognizing the advantages of SiP technologies in achieving compact and efficient electronic solutions. For instance, in aerospace applications, where weight and space are critical factors, SiP can enable the integration of multiple components without compromising performance. The "Others" category is anticipated to grow steadily as industries explore the benefits of advanced packaging technologies and seek to innovate their electronic systems. The versatility of SiP solutions makes them applicable across a wide range of sectors, enhancing their market potential significantly.

By Interconnection Technology

Wire Bond:

Wire Bond technology is one of the foundational methods used in semiconductor packaging, involving the connection of chip pads to the package substrate using fine wires. This technique is widely employed due to its simplicity and cost-effectiveness, making it suitable for various applications, including consumer electronics and telecommunications. Wire Bond technology provides reliable electrical connections while allowing for efficient production processes. Despite the emergence of more advanced interconnection methods, Wire Bond remains popular due to its proven track record and effectiveness in many standard packaging scenarios.

Flip Chip:

Flip Chip technology has gained prominence as a highly efficient interconnection method, connecting components directly to the substrate without the need for wires. This approach significantly improves electrical performance by reducing interconnect lengths and enhancing signal integrity. As the demand for high-speed data processing continues to grow in sectors such as telecommunications and computing, Flip Chip technology is becoming increasingly relevant. By enabling compact designs with higher integration levels, Flip Chip interconnections are anticipated to play a crucial role in the growth of System in Package solutions.

Through-Silicon Vias (TSV):

Through-Silicon Vias (TSV) represent an innovative interconnection technology that allows vertical connections between stacked silicon dies within a package. This approach enhances connectivity and reduces latency, making it ideal for high-performance applications, including data centers and advanced computing systems. TSV technology enables manufacturers to create more compact and efficient designs by minimizing the footprint while enhancing overall performance. The growing demand for high-density applications and advanced packaging solutions is expected to drive the adoption of TSV technology in the System in Package market.

Others:

The "Others" category encompasses various emerging interconnection technologies that are being developed to meet specific application requirements. These may include advanced fan-out techniques, integrated passive devices, and novel materials that improve electrical performance and heat dissipation. As industries continue to innovate and demand higher performance from their electronic systems, the adoption of these alternative interconnection methods is expected to grow. The versatility and adaptability of these technologies allow for the customization of packaging solutions across various sectors, creating opportunities for growth within the System in Package market.

By Region

The regional analysis of the System in Package market indicates that Asia Pacific holds the largest share, accounting for approximately 45% of the global market. This dominance is primarily driven by the presence of leading semiconductor manufacturers in countries like China, Japan, and South Korea, where there is substantial demand for consumer electronics and telecommunications. The region is also experiencing significant technological advancements in packaging solutions, further fueling its growth. The CAGR for the Asia Pacific region is projected to be around 15%, reflecting the rapid expansion of industries reliant on advanced electronic solutions.

North America follows closely, representing about 25% of the global market share, driven by the demand from the automotive and healthcare sectors. The region's focus on innovation and advancements in semiconductor technologies is contributing to the growth of the SiP market. Europe accounts for approximately 20% of the market, with strong investments in telecommunications and automotive sectors. The Middle East & Africa and Latin America collectively hold the remaining share, characterized by steady growth and emerging opportunities in various industries. The overall regional trends indicate a robust market landscape that is expected to evolve rapidly as technology continues to advance.

Opportunities

The System in Package market presents numerous opportunities for growth, particularly in the consumer electronics sector. As technology continues to evolve, there is an ever-increasing demand for compact, high-performance devices. This trend is pushing manufacturers to explore advanced packaging solutions that allow for greater integration of functions within a smaller footprint. The rise of the Internet of Things (IoT) is also creating opportunities for SiP technologies, as these devices often require the integration of multiple components to operate efficiently. As manufacturers seek to develop innovative products that cater to the needs of tech-savvy consumers, the opportunities for SiP solutions in this sector are expected to expand significantly. Furthermore, as 5G technology becomes more widespread, the demand for sophisticated electronic systems capable of handling higher data rates will further drive the growth of the SiP market.

Another promising opportunity lies in the automotive industry, where the transition towards electric vehicles (EVs) and increased levels of automation are reshaping the landscape. System in Package technologies can play a critical role in enabling the development of advanced driver-assistance systems (ADAS) and other complex electronic systems required in modern vehicles. As governments and manufacturers prioritize sustainability and safety in automotive design, the demand for integrated and efficient electronic solutions will continue to rise. Additionally, the healthcare sector is witnessing a growing focus on telehealth and remote patient monitoring, creating further opportunities for SiP technologies in medical devices and diagnostic equipment. Overall, the market for System in Package solutions is ripe with potential across diverse industries, making it a focal point for innovation and development.

Threats

While the System in Package market is poised for growth, several threats could potentially hinder its expansion. One significant threat is the rapid pace of technological advancements within the semiconductor industry. New packaging technologies are continuously emerging, which may render existing SiP solutions obsolete if companies fail to adapt quickly. This dynamic environment necessitates heavy investment in research and development to keep pace with evolving technologies, which can be challenging for smaller companies or those with limited resources. Additionally, supply chain disruptions experienced during global crises, such as the COVID-19 pandemic, have exposed vulnerabilities in the semiconductor supply chain, leading to increased lead times and costs for manufacturers. Such disruptions can impact the timely delivery of SiP solutions, affecting competitiveness in the market.

Another threat facing the System in Package market is the growing competition from emerging markets, particularly in Asia Pacific. Countries like China and India are investing heavily in semiconductor manufacturing capabilities, leading to increased competition for established players in the market. As these regions continue to grow, they may offer lower-cost alternatives that challenge existing SiP solutions. Additionally, the potential for regulatory changes and shifts in trade policies could impact the global supply chain dynamics for the semiconductor industry, creating uncertainty for companies operating in multiple regions. Companies must remain vigilant and adaptable to navigate these threats effectively, ensuring their continued success in the evolving SiP market.

Competitor Outlook

• Intel Corporation
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Qualcomm Incorporated
• Broadcom Inc.
• Texas Instruments Incorporated
• Micron Technology, Inc.
• NXP Semiconductors N.V.
• STMicroelectronics N.V.
• Infineon Technologies AG
• Amkor Technology, Inc.
• ASE Group
• Formosa Advanced Technologies Co., Ltd.
• Unimicron Technology Corp.
• Siliconware Precision Industries Co., Ltd.

The competitive landscape of the System in Package market is characterized by the presence of established semiconductor companies and several emerging players. Leading organizations like Intel, Samsung, and TSMC are continually investing in advanced packaging technologies to maintain their market dominance and meet the increasing demands for high-performance electronic solutions. As technological advancements continue to reshape the semiconductor industry, these companies are focused on developing innovative SiP solutions that enhance integration, efficiency, and performance. The competition is also intensifying as companies expand their product offerings to include more specialized solutions tailored to specific industries, such as automotive and healthcare.

Additionally, the market is witnessing the entry of new players who are leveraging advancements in manufacturing processes to disrupt traditional packaging methods. Companies such as Amkor and ASE Group are focusing on enhancing their capabilities in System in Package technologies, allowing them to compete effectively with established giants. As the demand for customized and integrated solutions grows, these companies are well-positioned to capitalize on emerging opportunities in the market. The competitive landscape will continue to evolve as companies strive to differentiate their offerings through innovation, strategic partnerships, and the development of cutting-edge technologies that address the specific needs of various industries.

Some prominent players in the market, such as Qualcomm and Broadcom, are particularly focused on developing System in Package solutions that cater to the telecommunications sector, where high data rates and low latency are crucial. By investing in research and development, these companies are enhancing their product portfolios to include more advanced SiP solutions that meet the evolving requirements of 5G technology. Furthermore, organizations like NXP and STMicroelectronics are concentrating on automotive applications, where the demand for sophisticated electronic systems is rapidly increasing. As the market continues to grow, these key players are likely to play a pivotal role in shaping the future of the System in Package landscape through their innovative approaches and commitments to excellence.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 ASE Group
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Broadcom Inc.
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Intel Corporation
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Qualcomm Incorporated
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 Amkor Technology, Inc.
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Micron Technology, Inc.
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 NXP Semiconductors N.V.
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 STMicroelectronics N.V.
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 Infineon Technologies AG
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Unimicron Technology Corp.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Samsung Electronics Co., Ltd.
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Texas Instruments Incorporated
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Formosa Advanced Technologies Co., Ltd.
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Siliconware Precision Industries Co., Ltd.
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Taiwan Semiconductor Manufacturing Company (TSMC)
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 System in Package Market, By User Industry
    • 6.1.1 Consumer Electronics
    • 6.1.2 Telecommunications
    • 6.1.3 Automotive
    • 6.1.4 Healthcare
    • 6.1.5 Others
  • 6.2 System in Package Market, By Packaging Technology
    • 6.2.1 2D IC Packaging
    • 6.2.2 2.5D IC Packaging
    • 6.2.3 3D IC Packaging
    • 6.2.4 Fan-out WLP
    • 6.2.5 Flip Chip
    • 6.2.6 Others
  • 6.3 System in Package Market, By Interconnection Technology
    • 6.3.1 Wire Bond
    • 6.3.2 Flip Chip
    • 6.3.3 Through-Silicon Vias
    • 6.3.4 Others

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 System in Package Market by Region
  • 10.6 Middle East & Africa - Market Analysis
    • 10.6.1 By Country
      • 10.6.1.1 Middle East
      • 10.6.1.2 Africa

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global System in Package market is categorized based on

By Packaging Technology

• 2D IC Packaging
• 2.5D IC Packaging
• 3D IC Packaging
• Fan-out WLP
• Flip Chip
• Others

By User Industry

• Consumer Electronics
• Telecommunications
• Automotive
• Healthcare
• Others

By Interconnection Technology

• Wire Bond
• Flip Chip
• Through-Silicon Vias
• Others

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• Intel Corporation
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Qualcomm Incorporated
• Broadcom Inc.
• Texas Instruments Incorporated
• Micron Technology, Inc.
• NXP Semiconductors N.V.
• STMicroelectronics N.V.
• Infineon Technologies AG
• Amkor Technology, Inc.
• ASE Group
• Formosa Advanced Technologies Co., Ltd.
• Unimicron Technology Corp.
• Siliconware Precision Industries Co., Ltd.