Pin Fin Heat Sink for IGBT

Pin Fin Heat Sink for IGBT Market Outlook

The global Pin Fin Heat Sink market, particularly for Insulated Gate Bipolar Transistor (IGBT) applications, is projected to reach approximately USD 1.5 billion by 2035, growing at a CAGR of around 5.8% during the forecast period of 2025-2035. This growth can be attributed to the increasing demand for efficient thermal management solutions in various industries, driven by the rising adoption of IGBT technology in electric vehicles, renewable energy systems, and high-power electronics. The expanding automotive and electronics sectors, coupled with the growing emphasis on energy efficiency and reduced thermal resistance, significantly contribute to the market's expansion. Furthermore, the shift toward more advanced thermal management systems in electronics is anticipated to enhance the adoption of pin fin heat sinks, ensuring optimal performance and longevity of components.

Growth Factor of the Market

The growth of the Pin Fin Heat Sink market is primarily driven by the increasing need for efficient cooling solutions in high-performance applications, particularly in the automotive and electronics industries. As the power requirements of electronic components evolve, the demand for effective thermal management systems becomes imperative to prevent overheating and ensure reliability. Additionally, the rise of electric vehicles, which utilize IGBT technology for power conversion and motor control, is significantly boosting the demand for advanced heat sinks. Moreover, the trend towards miniaturization of electronic devices necessitates the development of compact yet highly efficient cooling solutions, further propelling the market forward. The ongoing advancements in materials and manufacturing processes, such as the introduction of lightweight and high-conductivity materials, also serve as a catalyst for market growth. Finally, the increasing focus on sustainability and energy efficiency within various sectors is compelling manufacturers to innovate and develop more effective thermal solutions, thus driving the Pin Fin Heat Sink market.

Key Highlights of the Market

• The Pin Fin Heat Sink market is projected to experience a CAGR of 5.8% from 2025 to 2035.
• Increasing demand for electric vehicles significantly boosts the market for heat sinks.
• Technological advancements in thermal management solutions are enhancing product efficiency.
• Rising miniaturization in electronics is driving the need for compact heat sinks.
• The market is characterized by significant innovations in materials and manufacturing processes.

By Product Type

Straight Pin Heat Sink:

Straight Pin Heat Sinks are among the most commonly used types in thermal management applications. They are designed with vertical pins that enhance surface area, facilitating efficient heat dissipation through convection and radiation. The simplicity of their structure allows for easy manufacturing and integration into various electronic systems, making them a popular choice for cooling solutions in consumer electronics and industrial applications. Their effectiveness in dissipating heat makes them ideal for moderate power applications where space constraints are manageable. As technology continues to advance, designs are becoming more optimized, further enhancing their cooling capabilities and adaptability across different sectors.

Angled Pin Heat Sink:

Angled Pin Heat Sinks offer a unique design that improves airflow around the heat sink, leading to enhanced thermal performance. The angled pins create a more turbulent airflow pattern, which significantly increases convective heat transfer. This type of heat sink is particularly effective in applications where thermal management is critical, such as high-power electronics and IGBT modules. The design flexibility allows for customization in terms of height and pin density, which means they can be tailored to specific cooling requirements. As a result, angled pin heat sinks are gaining traction in industries where heat dissipation is paramount, contributing to the overall growth of the market.

Customized Pin Heat Sink:

Customized Pin Heat Sinks are designed to meet unique specifications and requirements of specific applications. These heat sinks are particularly valuable in niche markets where standard heat sinks cannot provide adequate performance. By allowing for adjustments in dimensions, pin configurations, and materials, customized solutions offer optimal thermal management tailored to the individual needs of various electronic components. The ability to create bespoke designs not only improves thermal efficiency but also enhances the aesthetic appeal of the products. As industries seek more specialized thermal solutions, the demand for customized pin heat sinks is expected to grow significantly.

High Performance Pin Heat Sink:

High Performance Pin Heat Sinks are engineered for maximum thermal efficiency, often utilizing advanced materials and innovative designs to achieve superior heat dissipation. These heat sinks are crucial in high-power applications, such as automotive power electronics and server cooling, where traditional solutions may fall short. The use of high thermal conductivity materials and optimized pin geometries allows for effective management of heat in demanding environments, making them indispensable for performance-critical systems. With the continuous evolution of electronic devices and the increasing demand for high-performance cooling solutions, the market for high-performance pin heat sinks is poised for significant growth.

Slant Pin Heat Sink:

Slant Pin Heat Sinks are characterized by their unique slanted pin configuration, which is designed to enhance airflow and thermal performance. This innovative design reduces the buildup of stagnant air, allowing for more efficient heat dissipation in various applications. The slant angle can be adjusted based on specific performance requirements, making them suitable for a range of industries including automotive, aerospace, and telecommunications. Slant pin heat sinks are particularly effective in environments where airflow is restricted, providing a reliable solution for managing heat in compact spaces. As the demand for efficient thermal management solutions continues to rise, these heat sinks are becoming increasingly popular among manufacturers.

By Application

Automotive:

The automotive sector plays a significant role in driving the demand for pin fin heat sinks, particularly with the rise of electric vehicles (EVs) and hybrid vehicles. IGBT modules used in EVs require effective thermal management solutions to ensure their optimal performance and reliability. Pin fin heat sinks are essential in dissipating the heat generated by power electronics, helping to maintain efficiency and prevent overheating. As automotive technologies evolve and the demand for greener alternatives increases, the need for advanced thermal management solutions in this sector is expected to grow, further boosting the pin fin heat sink market.

Electronics:

The electronics industry is one of the largest consumers of pin fin heat sinks, owing to the increasing miniaturization of devices and the rising power densities of electronic components. Effective thermal management is critical to ensure the longevity and reliability of electronic devices, and pin fin heat sinks provide a highly efficient solution. They are widely used in applications ranging from consumer electronics to industrial electronics, facilitating efficient heat dissipation in compact spaces. As the demand for high-performance electronics continues to rise, so does the necessity for effective cooling solutions like pin fin heat sinks.

Aerospace:

In the aerospace sector, pin fin heat sinks are utilized to manage the thermal challenges associated with high-performance avionics and power systems. The stringent requirements for reliability and performance in aerospace applications necessitate advanced thermal management solutions that can withstand extreme conditions. Pin fin heat sinks provide efficient heat dissipation while maintaining a lightweight design, which is crucial for aircraft performance. As the aerospace industry embraces more electric and hybrid aircraft technologies, the demand for effective thermal management solutions, including pin fin heat sinks, is expected to rise significantly.

Industrial:

The industrial sector is another significant application area for pin fin heat sinks, where they are employed in various machinery and equipment that generate substantial heat. Effective thermal management is vital for the optimal functioning of industrial equipment, and pin fin heat sinks provide robust solutions for dissipating heat in manufacturing, processing, and energy generation facilities. With the increasing focus on automation and sophisticated manufacturing technologies, the demand for efficient cooling solutions in industrial settings continues to grow, positioning pin fin heat sinks as a preferred option for many applications.

Telecommunications:

In the telecommunications industry, the implementation of pin fin heat sinks is critical for managing the heat generated by high-power RF components and network equipment. As the demand for data transmission and wireless communication services escalates, so does the need for reliable thermal management solutions to ensure the performance and longevity of telecommunications equipment. Pin fin heat sinks offer a compact and efficient means of dissipating heat in densely packed systems, thereby enhancing the reliability of network infrastructure. With the rapid evolution of communication technologies, the demand for effective cooling solutions in this sector is anticipated to increase, driving further growth in the pin fin heat sink market.

By Distribution Channel

Direct Sales:

Direct sales channels play a vital role in the distribution of pin fin heat sinks, as manufacturers often sell their products directly to end-users or businesses. This approach allows for better communication between manufacturers and customers, ensuring that the specific requirements of clients are met effectively. Direct sales also enable manufacturers to establish a strong brand presence and enhance customer loyalty by providing tailored solutions and immediate support. Furthermore, the increasing trend of online sales platforms has made it easier for manufacturers to reach potential customers, enabling a more efficient distribution process and fostering market growth.

Indirect Sales:

Indirect sales channels, including distributors and resellers, are essential in expanding the reach of pin fin heat sinks across various markets. These intermediaries often have established networks and customer bases, making it easier for manufacturers to penetrate diverse market segments without incurring the costs associated with direct sales. By leveraging the expertise and market knowledge of distributors, manufacturers can ensure that their products are available to a wider audience. Indirect sales channels also facilitate a smoother supply chain process, allowing for better inventory management and distribution, thus contributing to the overall growth of the pin fin heat sink market.

By Material Type

Aluminum:

Aluminum is one of the most widely used materials for pin fin heat sinks due to its excellent thermal conductivity, lightweight properties, and cost-effectiveness. The high thermal efficiency of aluminum helps in the effective dissipation of heat, making it ideal for a range of applications in electronics and automotive industries. Moreover, aluminum's corrosion resistance and ease of fabrication allow for the production of complex shapes and designs, enhancing its applicability in various thermal management solutions. As the demand for efficient cooling solutions continues to grow, aluminum-based pin fin heat sinks are expected to remain a leading choice among manufacturers.

Copper:

Copper is another popular material used in the production of pin fin heat sinks, primarily owing to its exceptional thermal conductivity, which is significantly higher than that of aluminum. This property enables copper heat sinks to dissipate heat more effectively, making them suitable for high-performance applications in electronics, aerospace, and automotive industries. Although copper is heavier and more expensive than aluminum, its superior thermal performance often justifies its use in critical applications where efficient heat dissipation is paramount. As industries continue to push for higher efficiency in thermal management, the demand for copper pin fin heat sinks is expected to rise.

Steel:

Steel pin fin heat sinks are less common but still have their applications, particularly in situations where strength and durability are paramount. While steel does not have the same level of thermal conductivity as aluminum or copper, its robustness makes it suitable for harsh environments where mechanical stability is essential. These heat sinks are often used in industrial applications where resistance to physical stress and corrosion is critical. As industries demand more resilient thermal management solutions, steel pin fin heat sinks may see an increase in adoption, particularly in heavy-duty applications.

Titanium:

Titanium pin fin heat sinks are emerging as a specialized solution for applications requiring enhanced corrosion resistance and lightweight design. Although titanium is more expensive compared to aluminum and copper, its unique properties make it an attractive option for aerospace and military applications where performance and durability are critical. The high strength-to-weight ratio of titanium allows for the manufacturing of efficient heat sinks without adding significant weight, making them ideal for use in sensitive electronic systems. As more industries recognize the benefits of titanium for thermal management, the market for titanium pin fin heat sinks is expected to grow.

Other Metals:

Other metals used in the production of pin fin heat sinks include alloys and specialty metals that may offer specific advantages for certain applications. These materials may provide a combination of properties such as enhanced thermal performance, weight reduction, or corrosion resistance tailored to meet the unique requirements of various industries. For example, certain metal alloys can provide improved mechanical strength while maintaining reasonable thermal conductivity, making them suitable for demanding environments. As technology advances and the need for customized thermal solutions increases, the segment of other metals in the pin fin heat sink market may experience growth through innovation and application-specific designs.

By Region

The North American region is expected to hold a significant share of the pin fin heat sink market, with a projected value of approximately USD 600 million by 2035, driven by the robust growth of the automotive and electronics industries. The increasing adoption of electric vehicles and the necessity for efficient thermal management solutions in power electronics are key factors propelling market growth. Furthermore, advancements in manufacturing technologies and increased investment in research and development are anticipated to enhance the capabilities of pin fin heat sinks, contributing to the region's market expansion. Expected to grow at a CAGR of 6.2%, North America remains a crucial market for thermal management solutions.

In Europe, the pin fin heat sink market is also experiencing substantial growth, with an estimated market size of USD 450 million by 2035. The region's emphasis on energy efficiency and sustainability, particularly in the automotive and aerospace sectors, drives demand for high-performance thermal management systems. Countries like Germany, France, and the United Kingdom are leading the charge in adopting advanced technologies, further fueling the demand for pin fin heat sinks. As manufacturers strive to meet stringent regulatory standards for energy efficiency, their focus on innovative thermal solutions is expected to bolster the growth of the market in this region.

Opportunities

The pin fin heat sink market is poised for significant growth due to the increasing demand for electric vehicles (EVs) and the push for enhanced thermal management solutions in high-performance electronics. The automotive industry is undergoing a transformational shift towards electrification, necessitating advanced thermal solutions to manage the heat generated by IGBT modules and electric drivetrains. This transition presents a prime opportunity for manufacturers to innovate and develop pin fin heat sinks that cater to the specific cooling requirements of EV applications. Additionally, as the global focus shifts towards sustainability and energy efficiency, manufacturers can capitalize on this trend by promoting the advantages of pin fin heat sinks in enhancing the performance and longevity of electronic components, thereby providing a competitive edge in the market.

Moreover, the rapid advancements in technology and materials used in thermal management systems are opening new avenues for growth in the pin fin heat sink market. The introduction of lightweight, high-conductivity materials and innovative manufacturing techniques enables the development of more efficient and cost-effective cooling solutions. As industries increasingly seek sustainable and efficient thermal management options, there is a growing demand for customized pin fin heat sink designs tailored to meet specific application needs. This presents an opportunity for manufacturers to diversify their product offerings and expand into new markets, such as renewable energy and telecommunications, where effective thermal management is essential for operational efficiency. By leveraging these opportunities, the pin fin heat sink market is set to experience robust growth in the coming years.

Threats

One of the significant threats facing the pin fin heat sink market is the growing competition from alternative cooling solutions, such as heat pipes and vapor chamber technologies. These technologies offer specific advantages in certain applications, such as more uniform heat distribution and reduced thermal resistance, which may impact the market share of pin fin heat sinks in the long run. Additionally, the rapid pace of technological advancements in the thermal management industry presents a challenge for manufacturers to continuously innovate and improve their products. Failure to keep pace with emerging technologies may result in a loss of competitive advantage and market share. Furthermore, fluctuations in raw material prices, particularly for metals like aluminum and copper, can significantly impact production costs and profit margins, posing a threat to overall market stability.

Another concern is the potential regulatory challenges related to environmental sustainability and energy efficiency standards. With increasing regulations aimed at reducing carbon footprints and promoting energy-efficient technologies, manufacturers of pin fin heat sinks may face pressure to comply with stringent guidelines. This could lead to increased production costs and necessitate investment in research and development to meet evolving standards. Additionally, economic fluctuations and uncertainties in global markets may affect the overall demand for thermal management solutions, impacting the growth of the pin fin heat sink market. As manufacturers navigate these threats, strategic planning and adaptability will be essential to maintain a competitive edge in the evolving landscape.

Competitor Outlook

• Thermal Solutions Inc.
• Advanced Thermal Solutions, Inc.
• Cooler Master Co., Ltd.
• Sunonwealth Electric Machine Industry Co., Ltd.
• Fujipoly America Corp.
• Fischer Elektronik GmbH & Co. KG
• TE Connectivity Ltd.
• Delta Electronics, Inc.
• Ohmcraft, Inc.
• 3M Company
• Harris Thermal Solutions
• Schneider Electric
• Nova Electric
• Wieland Electric GmbH
• Thermal Management Technologies LLC

The competitive landscape of the pin fin heat sink market is characterized by a diverse range of players, from established manufacturers to emerging startups, each vying for market share in this growing industry. Key players are focusing on innovation and product development to enhance the efficiency and performance of their thermal management solutions. Many of these companies are investing in research and development to create advanced materials and manufacturing techniques that improve the thermal performance of pin fin heat sinks, thereby meeting the evolving demands of various industries. Strategic partnerships, mergers, and acquisitions are also prevalent as companies seek to expand their product portfolios and market reach, positioning themselves to capitalize on the increasing demand for effective thermal management solutions.

Major companies like Thermal Solutions Inc. and Advanced Thermal Solutions, Inc. are leading the charge in developing innovative pin fin heat sink designs tailored for high-performance applications. These companies leverage their expertise in thermal management to create solutions that address the unique cooling requirements of diverse sectors, including automotive, electronics, and aerospace. Additionally, Cooler Master Co., Ltd. and Sunonwealth Electric Machine Industry Co., Ltd. focus on integrating advanced technologies into their product offerings, ensuring that their heat sinks remain competitive in terms of performance and efficiency. By continuously adapting to market trends and customer needs, these companies play a key role in shaping the future of the pin fin heat sink market.

Furthermore, companies such as Fujipoly America Corp. and TE Connectivity Ltd. are recognized for their commitment to sustainability and energy efficiency in thermal management solutions. They are actively working to develop eco-friendly heat sink materials and manufacturing processes to meet the growing demand for sustainable products. This focus on environmental responsibility not only helps them comply with regulatory standards but also appeals to environmentally-conscious consumers and businesses. As the competitive landscape continues to evolve, companies that prioritize innovation, sustainability, and customer-centric solutions will likely emerge as leaders in the pin fin heat sink market.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 3M Company
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Nova Electric
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Ohmcraft, Inc.
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Schneider Electric
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 TE Connectivity Ltd.
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Wieland Electric GmbH
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Fujipoly America Corp.
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Thermal Solutions Inc.
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 Cooler Master Co., Ltd.
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Delta Electronics, Inc.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Harris Thermal Solutions
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Advanced Thermal Solutions, Inc.
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Fischer Elektronik GmbH & Co. KG
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Thermal Management Technologies LLC
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Sunonwealth Electric Machine Industry Co., Ltd.
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 Pin Fin Heat Sink for IGBT Market, By Application
    • 6.1.1 Automotive
    • 6.1.2 Electronics
    • 6.1.3 Aerospace
    • 6.1.4 Industrial
    • 6.1.5 Telecommunications
  • 6.2 Pin Fin Heat Sink for IGBT Market, By Product Type
    • 6.2.1 Straight Pin Heat Sink
    • 6.2.2 Angled Pin Heat Sink
    • 6.2.3 Customized Pin Heat Sink
    • 6.2.4 High Performance Pin Heat Sink
    • 6.2.5 Slant Pin Heat Sink
  • 6.3 Pin Fin Heat Sink for IGBT Market, By Material Type
    • 6.3.1 Aluminum
    • 6.3.2 Copper
    • 6.3.3 Steel
    • 6.3.4 Titanium
    • 6.3.5 Other Metals
  • 6.4 Pin Fin Heat Sink for IGBT Market, By Distribution Channel
    • 6.4.1 Direct Sales
    • 6.4.2 Indirect Sales

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Middle East & Africa - Market Analysis
    • 10.5.1 By Country
      • 10.5.1.1 Middle East
      • 10.5.1.2 Africa
  • 10.6 Pin Fin Heat Sink for IGBT Market by Region

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global Pin Fin Heat Sink for IGBT market is categorized based on

By Product Type

• Straight Pin Heat Sink
• Angled Pin Heat Sink
• Customized Pin Heat Sink
• High Performance Pin Heat Sink
• Slant Pin Heat Sink

By Application

• Automotive
• Electronics
• Aerospace
• Industrial
• Telecommunications

By Distribution Channel

• Direct Sales
• Indirect Sales

By Material Type

• Aluminum
• Copper
• Steel
• Titanium
• Other Metals

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• Thermal Solutions Inc.
• Advanced Thermal Solutions, Inc.
• Cooler Master Co., Ltd.
• Sunonwealth Electric Machine Industry Co., Ltd.
• Fujipoly America Corp.
• Fischer Elektronik GmbH & Co. KG
• TE Connectivity Ltd.
• Delta Electronics, Inc.
• Ohmcraft, Inc.
• 3M Company
• Harris Thermal Solutions
• Schneider Electric
• Nova Electric
• Wieland Electric GmbH
• Thermal Management Technologies LLC