Molded Interconnect Devices Sales

Molded Interconnect Devices Sales Market Outlook

The global Molded Interconnect Devices (MIDs) market is projected to reach approximately USD 5 billion by 2035, with a compound annual growth rate (CAGR) of around 12% during the forecast period from 2025 to 2035. This significant growth is primarily driven by the increasing demand for compact and efficient electronic components across various industries such as automotive, healthcare, and consumer electronics. The continuous advancements in technology and the miniaturization of electronic devices are encouraging manufacturers to adopt MIDs for their flexibility and reliability. Moreover, the growing emphasis on automation and the implementation of IoT solutions in industrial applications propel the market forward. In addition, the rising trend of electric vehicles is expected to further boost the adoption of MIDs, as these devices can significantly reduce weight and space, ultimately leading to enhanced performance.

Growth Factor of the Market

One of the primary growth factors for the Molded Interconnect Devices market is the relentless pursuit of miniaturization in the electronics industry. As devices become smaller and more integrated, manufacturers are increasingly turning to MIDs to achieve higher performance while saving space. Additionally, the automotive sector is experiencing a transformation with the rise of electric vehicles, which requires advanced electronic solutions that MIDs can provide. Another contributing aspect is the demand for enhanced functionality in healthcare devices, where MIDs can improve reliability and patient outcomes. Furthermore, the push towards sustainable manufacturing processes is leading to innovations that favor MIDs due to their ability to incorporate multiple functions into a single component, reducing waste during production. Lastly, the surge in consumer electronics, with a focus on smart devices and wearables, is creating a robust market opportunity for MIDs as these products require advanced interconnect solutions.

Key Highlights of the Market

• The global MIDs market is projected to reach USD 5 billion by 2035.
• Automotive applications account for a significant share of the market.
• Asia Pacific is expected to witness the highest growth rate during the forecast period.
• Flexible MIDs are gaining popularity due to their adaptability in various applications.
• Technological advancements are leading to increased functionality and integration of MIDs.

By Product Type

Single-Layer MIDs:

Single-layer Molded Interconnect Devices are known for their simplicity and cost-effectiveness. They consist of a single layer of material that integrates conductive pathways and other electronic components. This type of MID is particularly advantageous in applications where space is limited, and the design demands straightforward connectivity. Their ease of manufacturing and lower production costs make them a popular choice for high-volume consumer electronic products, such as remote controls and smaller household devices. Moreover, as the industry progresses, advancements in printing technology and materials have allowed for improved performance and reliability in single-layer MIDs, further driving their adoption across various sectors.

Double-Layer MIDs:

Double-layer Molded Interconnect Devices offer enhanced functionality compared to their single-layer counterparts. With two layers of conductive pathways, they allow for more complex circuitry while maintaining a compact form factor. These devices are increasingly being used in automotive applications, where multiple electrical connections are required in confined spaces. The ability to integrate more components into a smaller area makes double-layer MIDs particularly attractive for manufacturers looking to optimize design and performance. Additionally, the growing trend of electric and hybrid vehicles is likely to drive demand for double-layer MIDs, as they contribute to weight reduction and efficiency in automotive systems.

Multilayer MIDs:

Multilayer Molded Interconnect Devices represent the most advanced segment of the MID market, allowing for intricate and highly integrated electronic designs. These devices consist of multiple layers of materials, enabling complex routing of electrical pathways and the integration of various electronic components. Multilayer MIDs are particularly prevalent in high-tech applications such as aerospace, medical devices, and advanced consumer electronics. The capacity to create sophisticated designs while adhering to strict size and weight restrictions makes multilayer MIDs a critical component in modern technology. Furthermore, as industries continue to push for more effective miniaturization and enhanced functionality in electronic devices, the demand for multilayer MIDs is expected to rise significantly.

Flexible MIDs:

Flexible Molded Interconnect Devices are designed for applications that require adaptability and movement, making them ideal for wearable electronics and other portable devices. Their flexible nature allows them to be bent or shaped to fit various designs, which is increasingly important in consumer electronics and healthcare applications. The use of flexible MIDs can lead to increased durability in products that experience frequent movement or contact. Moreover, as the demand for wearables and IoT devices continues to grow, manufacturers are increasingly incorporating flexible MIDs into their designs, enhancing both functionality and user experience.

Rigid MIDs:

Rigid Molded Interconnect Devices are characterized by their robust structure, making them suitable for applications where durability and stability are essential. These devices are commonly utilized in automotive and industrial applications, where they can withstand harsh conditions and significant mechanical stress. The rigidity of these MIDs allows for reliable performance in environments that may pose challenges to more flexible designs. As industries continue to seek reliable and efficient solutions for their electronic needs, the demand for rigid MIDs is expected to remain strong, particularly as the automotive sector embraces more advanced electronic systems.

By Application

Automotive:

The automotive sector is a significant driver of the Molded Interconnect Devices market, thanks to the increasing complexity of modern vehicles. With the rise of electric and autonomous vehicles, the demand for efficient and compact electronic connections has surged. MIDs play a crucial role in managing the extensive wiring and connectivity required for various automotive systems, from control units to infotainment systems. Their ability to integrate multiple functions into a single device not only helps reduce weight but also enhances the overall reliability of the vehicle's electronic systems. As automotive manufacturers continue to innovate and implement advanced technologies, the use of MIDs is expected to grow substantially in this sector.

Healthcare:

The healthcare application for MIDs is rapidly expanding, driven by the need for more reliable and compact medical devices. MIDs are increasingly being integrated into diagnostic equipment, monitoring devices, and surgical instruments due to their ability to accommodate intricate electronic pathways in a limited space. The trend towards miniaturization in healthcare technology, especially in wearable devices and portable diagnostics, significantly boosts the demand for MIDs. Furthermore, the reliability and durability offered by MIDs are essential in medical applications, where precision and performance can directly impact patient outcomes.

Consumer Electronics:

In the consumer electronics sector, MIDs are becoming a preferred choice due to their compact design and versatility. The ongoing demand for smaller, smarter devices such as smartphones, tablets, and smart home appliances is fostering the growth of the MID market. MIDs enable manufacturers to streamline their designs, reduce product size, and enhance functionality without sacrificing quality. As consumer preferences continue to evolve towards sleek designs and multifunctional devices, the adoption of Molded Interconnect Devices in this industry is expected to increase significantly.

Industrial:

The industrial application of MIDs is gaining momentum as automation and IoT technologies become more prevalent. Industries are increasingly seeking solutions that can improve efficiency, reduce downtime, and manage complex electrical connections in machinery and control systems. MIDs provide a reliable and compact solution for industrial electronics, making them well-suited for applications in factory automation, robotics, and process control. The shift towards smart manufacturing and Industry 4.0 is expected to drive more companies to adopt MIDs, contributing to market growth in this segment.

Aerospace & Defense:

The aerospace and defense sector requires high-performance electronic solutions that can operate in extreme conditions. MIDs are increasingly being utilized in this industry due to their robust design and ability to withstand harsh environments. The integration of MIDs into aerospace applications helps reduce the overall weight of aircraft and improves the reliability of critical systems. As aerospace manufacturers continue to focus on enhancing operational efficiency and safety, the demand for Molded Interconnect Devices in this sector is projected to grow, driven by advancements in technology and materials.

By Distribution Channel

Direct Sales:

Direct sales channels for Molded Interconnect Devices allow manufacturers to engage directly with customers, providing a more tailored approach to meet specific needs. This method often leads to stronger customer relationships, as clients can communicate their requirements directly to the manufacturers. Furthermore, direct sales facilitate quicker response times and customization options that are crucial for industries such as automotive and healthcare, where specifications can vary significantly. As companies seek to establish better control over their supply chain and customer interactions, the direct sales model is expected to grow in importance within the MID market.

Distributor Sales:

Distributor sales play a vital role in the Molded Interconnect Devices market by extending the reach of manufacturers to a broader audience. Distributors are typically well-established in their regions and have the necessary infrastructure to support sales and distribution effectively. They can provide valuable market insights to manufacturers while also assisting customers in finding the right products for their applications. This channel is particularly beneficial for smaller manufacturers looking to penetrate new markets without the expenses associated with direct sales operations. As the demand for MIDs continues to rise, distributor networks are anticipated to strengthen further, facilitating market growth across various applications.

Online Retail:

The online retail segment of the Molded Interconnect Devices market is experiencing rapid growth, driven by the increasing trend of e-commerce and digital purchasing. Online platforms provide customers with easy access to a wide range of MID products, enabling quick comparisons and informed decision-making. The convenience of online shopping, coupled with the growing number of manufacturers and suppliers establishing their online presence, is expanding market opportunities. Moreover, online retail allows for efficient inventory management and distribution, helping manufacturers respond more swiftly to market demands. As consumer preferences shift towards online purchasing, the MID market is likely to see significant growth in this distribution channel.

By Material Type

Plastic:

Plastic is one of the most commonly used materials in the production of Molded Interconnect Devices, known for its versatility and cost-effectiveness. The lightweight and durable nature of plastic makes it an ideal choice for various applications, particularly in consumer electronics and automotive sectors. Plastics can easily be molded into complex shapes, allowing for intricate designs that enhance functionality. Additionally, advancements in polymer technology have enabled the development of plastics that can withstand higher temperatures and provide better electrical insulation. As industries continue to demand lightweight and efficient electronic solutions, the preference for plastic-based MIDs is expected to remain strong.

Metal:

Metal materials are essential in the construction of Molded Interconnect Devices due to their excellent electrical conductivity and strength. MIDs made from metals are particularly beneficial in applications where performance and reliability are paramount, such as aerospace, defense, and industrial sectors. The ability to integrate metal components into molded designs allows manufacturers to create robust devices capable of withstanding harsh conditions. Moreover, the trend towards incorporating more sustainable materials is prompting innovations in metal processing and recycling, further enhancing the appeal of metal-based MIDs. As demand for high-performance electronic solutions grows, metal components will continue to play a crucial role in the MID market.

Ceramic:

Ceramic materials are increasingly being utilized in the production of Molded Interconnect Devices due to their exceptional thermal stability and insulating properties. These materials are particularly suitable for applications that involve high temperatures or require excellent electrical insulation, making them ideal for the aerospace and automotive sectors. The use of ceramics in MIDs can significantly reduce the risk of failure in critical electronic components. Furthermore, advancements in ceramic manufacturing processes have improved the feasibility of incorporating ceramics into complex designs. As industries continue to demand high-performance and reliable electronic solutions, the use of ceramic materials in the MID market is expected to rise.

Glass:

Glass is a unique material used in Molded Interconnect Devices, primarily due to its excellent properties such as high transparency and electrical insulation. While less common than plastics or metals, glass-based MIDs are gaining traction in specialized applications, particularly in medical devices and consumer electronics where aesthetic appeal and functionality are crucial. Glass can provide robust protection for sensitive electronic components while maintaining a lightweight profile. The development of advanced glass technologies is enabling manufacturers to explore innovative designs that incorporate both form and function. As the demand for high-end electronic products continues to rise, the incorporation of glass in MIDs may see significant growth.

Others:

In addition to the more common materials used in Molded Interconnect Devices, there are several other materials that can be utilized to meet specific application requirements. These may include composites and specialty polymers that offer unique properties suited for particular environments. The versatility of MIDs allows manufacturers to experiment with a variety of material combinations to achieve desired performance characteristics, such as enhanced strength, flexibility, or thermal resistance. As technology advances and industries evolve, the exploration of alternative materials is expected to expand, providing more options for customization and innovation in the MID market.

By Region

The Molded Interconnect Devices market exhibits substantial regional variance, significantly influenced by factors such as industrial growth, technological advancements, and market demand. North America is a significant player, accounting for approximately 30% of the global MID market share as of 2023, primarily due to the presence of major electronics manufacturers and a strong automotive industry focused on innovation and efficiency. Following closely, Europe is expected to grow at a CAGR of around 11% over the forecast period, driven by the region's commitment to advancing automotive electronics and healthcare technologies. Countries such as Germany and France are at the forefront of MID adoption, with increasing investments in research and development to enhance product capabilities.

Asia Pacific stands out as the fastest-growing region for Molded Interconnect Devices, anticipated to register a CAGR of over 14% during the forecast period. This growth is fueled by the rapid expansion of the electronics sector in countries like China, Japan, and South Korea, which are home to major global electronics manufacturers. The increasing demand for consumer electronics and IoT devices in this region is expected to drive significant market growth. Latin America and the Middle East & Africa are relatively smaller markets, but they are witnessing an uptick in demand for MIDs as industries increasingly recognize their advantages in various applications. Overall, the regional landscape for MIDs is dynamic, with each area contributing uniquely to the market's growth trajectory.

Opportunities

The Molded Interconnect Devices market presents numerous opportunities for manufacturers and suppliers, primarily driven by technological advancements and evolving consumer preferences. One of the most significant opportunities lies in the automotive sector, especially with the rise of electric vehicles (EVs) and autonomous driving technologies. As manufacturers strive to create more efficient and compact electronic solutions, the demand for MIDs that can integrate multiple functions into a single device is expected to surge. Additionally, the growing focus on sustainability and environmentally friendly manufacturing processes is encouraging innovations in MID production, opening up avenues for companies to differentiate their products in the market. As industries increasingly adopt smart manufacturing practices and IoT solutions, the demand for MIDs that support these technologies is set to grow, providing lucrative prospects for market players.

Another key opportunity for the Molded Interconnect Devices market is the healthcare sector, where the demand for advanced medical devices continues to rise. With the ongoing trend towards telemedicine and remote patient monitoring, MIDs can significantly enhance the functionality and reliability of medical devices, leading to improved patient outcomes. As healthcare providers seek innovative solutions to meet the evolving needs of patients, the integration of MIDs into medical technologies is becoming increasingly attractive. Moreover, the rapid development of wearable health monitoring devices creates additional opportunities for MIDs to be utilized in designs that require flexibility and compactness. As manufacturers tap into these burgeoning markets, the potential for growth in the MID sector remains promising.

Threats

Despite the favorable growth outlook for the Molded Interconnect Devices market, several threats could impede market expansion. One of the primary threats is the increasing competition from alternative technologies that offer similar functionalities, such as traditional circuit boards and other interconnect solutions. As companies continue to innovate and develop new materials and technologies, MIDs may face challenges in maintaining their market share. Additionally, fluctuations in raw material prices can impact production costs, leading to pricing pressures for manufacturers. This can further complicate market dynamics, especially for smaller players who may struggle to compete against larger companies with more substantial resources. Moreover, regulatory challenges in various regions concerning the safety and environmental impact of electronic components may pose additional hurdles for manufacturers in the MID market.

Another considerable concern for the Molded Interconnect Devices market is the rapid pace of technological advancements, which can render existing products obsolete. Manufacturers must consistently invest in research and development to stay ahead of the competition and meet the evolving needs of their customers. Failure to do so could result in lost market share and declining sales. Additionally, the global supply chain disruptions experienced during recent events, such as the COVID-19 pandemic, have highlighted vulnerabilities within the manufacturing sector. Such disruptions can lead to delays in production and delivery, negatively affecting business operations and customer relationships. As the MID market continues to evolve, companies must be vigilant in addressing these threats to maintain their competitive edge.

Competitor Outlook

• Amphenol Corporation
• TE Connectivity Ltd.
• Fischer Connectors SA
• 3M Company
• Bergquist Company
• Flextronics International Ltd.
• Schneider Electric SE
• Microchip Technology Inc.
• Würth Elektronik GmbH
• Jabil Inc.
• Sumitomo Electric Industries, Ltd.
• Yazaki Corporation
• Hirschmann Car Communication
• Samtec, Inc.
• Flex Ltd.

The competitive landscape of the Molded Interconnect Devices market is characterized by a diverse array of players, ranging from established global manufacturers to emerging companies that specialize in niche applications. These companies are heavily invested in research and development to innovate and introduce advanced products that meet the evolving demands of various industries. The presence of major players such as Amphenol Corporation and TE Connectivity Ltd. exemplifies the level of competition in this market. These companies leverage their extensive experience, technological expertise, and global reach to capture market share and drive growth. Moreover, strategic collaborations, mergers, and acquisitions are common as companies seek to enhance their product offerings and expand their market presence.

In addition to established firms, there are numerous smaller companies that contribute to the Molded Interconnect Devices market, focusing on specific applications or unique technologies. For instance, firms like Fischer Connectors and Bergquist Company are known for their specialized products that cater to particular sectors such as industrial and medical applications. These companies often adopt agile manufacturing processes and customer-centric approaches to differentiate themselves from larger competitors. As market demands continue to shift towards customization and flexibility, these niche players are poised to carve out their own segments within the broader MID market.

Furthermore, the global nature of the MID market has resulted in increased competition from international players, particularly from Asia-Pacific regions. Companies based in China, Japan, and South Korea are rapidly advancing in technology and production capabilities, posing challenges for traditional markets in North America and Europe. These international players often benefit from lower production costs and can offer competitive pricing, compelling existing market players to innovate and improve their offerings continually. As the Molded Interconnect Devices market evolves, understanding the competitive landscape and adapting to emerging trends will be crucial for all players striving for success in this dynamic environment.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 Flex Ltd.
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 3M Company
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Jabil Inc.
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Samtec, Inc.
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 Bergquist Company
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Yazaki Corporation
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Amphenol Corporation
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 TE Connectivity Ltd.
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 Fischer Connectors SA
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Schneider Electric SE
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Microchip Technology Inc.
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Hirschmann Car Communication
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Würth Elektronik GmbH
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Flextronics International Ltd.
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Sumitomo Electric Industries, Ltd.
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 Molded Interconnect Devices Sales Market, By Application
    • 6.1.1 Automotive
    • 6.1.2 Healthcare
    • 6.1.3 Consumer Electronics
    • 6.1.4 Industrial
    • 6.1.5 Aerospace & Defense
  • 6.2 Molded Interconnect Devices Sales Market, By Product Type
    • 6.2.1 Single-Layer MIDs
    • 6.2.2 Double-Layer MIDs
    • 6.2.3 Multilayer MIDs
    • 6.2.4 Flexible MIDs
    • 6.2.5 Rigid MIDs
  • 6.3 Molded Interconnect Devices Sales Market, By Material Type
    • 6.3.1 Plastic
    • 6.3.2 Metal
    • 6.3.3 Ceramic
    • 6.3.4 Glass
    • 6.3.5 Others
  • 6.4 Molded Interconnect Devices Sales Market, By Distribution Channel
    • 6.4.1 Direct Sales
    • 6.4.2 Distributor Sales
    • 6.4.3 Online Retail

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Middle East & Africa - Market Analysis
    • 10.5.1 By Country
      • 10.5.1.1 Middle East
      • 10.5.1.2 Africa
  • 10.6 Molded Interconnect Devices Sales Market by Region

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global Molded Interconnect Devices Sales market is categorized based on

By Product Type

• Single-Layer MIDs
• Double-Layer MIDs
• Multilayer MIDs
• Flexible MIDs
• Rigid MIDs

By Application

• Automotive
• Healthcare
• Consumer Electronics
• Industrial
• Aerospace & Defense

By Distribution Channel

• Direct Sales
• Distributor Sales
• Online Retail

By Material Type

• Plastic
• Metal
• Ceramic
• Glass
• Others

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• Amphenol Corporation
• TE Connectivity Ltd.
• Fischer Connectors SA
• 3M Company
• Bergquist Company
• Flextronics International Ltd.
• Schneider Electric SE
• Microchip Technology Inc.
• Würth Elektronik GmbH
• Jabil Inc.
• Sumitomo Electric Industries, Ltd.
• Yazaki Corporation
• Hirschmann Car Communication
• Samtec, Inc.
• Flex Ltd.