IC Carrier Tape

IC Carrier Tape Market Outlook

The global IC carrier tape market is projected to reach approximately USD 3 billion by 2035, growing at a CAGR of around 6.5% during the forecast period from 2025 to 2035. This growth can be attributed to various factors, including the increasing demand for miniaturized electronic components, the rapid development of the electronics industry, and the rising need for efficient packaging solutions to protect integrated circuits during transportation. Additionally, the expansion of the consumer electronics sector, spurred by innovations in smartphones, wearable devices, and IoT products, is further enhancing market prospects. The automotive industry's shift towards more advanced electronic systems, along with the growing trend of electric vehicles, is also expected to contribute significantly to the overall growth of the IC carrier tape market.

Growth Factor of the Market

One of the primary growth factors propelling the IC carrier tape market is the escalating demand for electronic devices that require high reliability and protection during handling and transportation. As the trend toward miniaturization continues, manufacturers are seeking advanced packaging solutions that can accommodate smaller, more delicate components without compromising quality or functionality. Moreover, the booming sectors of consumer electronics and automotive applications are driving the need for more sophisticated carrier tape products that can meet stringent industry standards. The increasing focus on automation and efficiency in production lines also plays a significant role in boosting the adoption of IC carrier tapes, as manufacturers aim to reduce waste and improve throughput. Another important factor is the rising investment in research and development activities related to advanced materials and adhesives used in production processes, which is anticipated to enhance product performance and broaden application scopes.

Key Highlights of the Market

• The market is projected to witness significant growth, with a CAGR of 6.5% from 2025 to 2035.
• Consumer electronics and automotive sectors are the primary contributors to market expansion.
• Adoption of advanced adhesive materials is enhancing the performance of IC carrier tapes.
• Integration of automation in manufacturing processes is driving efficiency and demand.
• The shift towards sustainable packaging solutions is influencing material selection in the industry.

By Product Type

PSA Heat Seal:

Pressure-Sensitive Adhesive (PSA) heat seal carrier tapes are gaining traction in the IC carrier tape market due to their robust adhesive properties and ease of application. These tapes are designed to provide excellent bonding without the requirement for additional heat or solvent, making them ideal for various electronic packaging applications. As manufacturers focus on improving production efficiency and reducing costs, PSA heat seal solutions are increasingly favored for their ability to streamline operations. Furthermore, their versatility allows for compatibility with a wide range of materials and application processes, making them suitable for use in diverse sectors, from consumer electronics to automotive components. The market for PSA heat seal carrier tapes is expected to expand significantly as these attributes align with increasing industry demands for reliable and efficient packaging solutions.

UV Curable Adhesive:

UV curable adhesive carrier tapes are another pivotal segment within the IC carrier tape market. These tapes utilize ultraviolet light to initiate a chemical reaction that cures the adhesive, resulting in a strong and durable bond. The benefits of UV curable adhesives include their rapid curing capabilities, allowing for quicker production cycles and enhanced manufacturing efficiency. As the electronics industry continuously seeks to optimize processes and reduce downtime, UV curable adhesive tapes are becoming increasingly popular. Moreover, their ability to provide excellent thermal and chemical resistance further enhances their suitability for high-performance applications, particularly in sectors where reliability is paramount, such as medical devices and aerospace technology. Thus, the growth of this segment is expected to be robust as manufacturers increasingly embrace the advantages of UV curable technologies.

Hot Melt Adhesive:

Hot melt adhesive carrier tapes are characterized by their quick bonding capabilities and strong adhesion properties, making them a favored choice for various applications in the IC carrier tape market. These adhesives are applied in a molten state and solidify upon cooling, resulting in a secure bond that is particularly beneficial for high-speed production lines. The increasing demand for efficient and reliable packaging solutions in the consumer electronics market is driving the growth of hot melt adhesive tapes, as they streamline assembly processes and reduce production times. Additionally, their versatility in adhering to different materials expands their application possibilities across various sectors, including automotive and industrial markets. As manufacturers prioritize speed and efficiency, we can expect a steady rise in the adoption of hot melt adhesive carrier tapes in the coming years.

Solvent-Based Adhesive:

Solvent-based adhesive carrier tapes are traditionally utilized in the packaging of integrated circuits due to their strong bonding characteristics and ability to withstand diverse environmental conditions. These tapes rely on solvent evaporation to create a strong adhesive bond, which makes them suitable for applications requiring high durability and resistance to heat and moisture. Despite facing competition from newer adhesive technologies, the solvent-based segment remains relevant, particularly in industries where performance and reliability are critical. The aerospace and automotive sectors, where components are subjected to rigorous conditions, continue to leverage solvent-based carrier tapes for their proven track record. However, the segment may face challenges due to increasing environmental regulations surrounding solvent use, leading to a potential shift towards more eco-friendly alternatives over the long term.

Water-Based Adhesive:

Water-based adhesive carrier tapes are emerging as a sustainable alternative within the IC carrier tape market, responding to the growing demand for environmentally friendly packaging solutions. These adhesives utilize water as the primary solvent, significantly reducing the volatile organic compounds (VOCs) associated with traditional solvent-based adhesives. As businesses increasingly prioritize sustainability and regulatory compliance, water-based adhesive tapes are becoming more appealing. Their adequate bonding strength and versatility make them suitable for a range of applications, particularly in consumer electronics and medical devices where safety and compliance are paramount. With the ongoing trend toward sustainable practices, the water-based adhesive segment is anticipated to experience robust growth, aligning market offerings with evolving consumer and regulatory expectations.

By Application

Consumer Electronics:

The consumer electronics segment is a key driver for the IC carrier tape market, characterized by rapid advancements in technology and the proliferation of electronic devices. As manufacturers strive to deliver compact and reliable products, the demand for efficient packaging solutions that protect delicate components during production and transport has surged. Carrier tapes play a crucial role in ensuring the safe handling of integrated circuits used in smartphones, tablets, laptops, and other electronic gadgets. Additionally, the increasing consumer preference for wearable technology and smart home devices further amplifies the demand for innovative packaging, positioning the consumer electronics sector as a primary growth engine for the IC carrier tape market.

Automotive:

In the automotive sector, the demand for IC carrier tapes is experiencing significant growth due to the integration of advanced electronic systems in vehicles. As modern automobiles become increasingly reliant on electronics for functions such as safety, navigation, and entertainment, manufacturers require robust packaging solutions to safeguard sensitive components. IC carrier tapes facilitate the efficient assembly and transportation of microchips and other electronic elements critical to vehicle performance. Furthermore, the transition to electric vehicles (EVs) and the incorporation of autonomous technologies are expected to further drive the need for reliable packaging solutions. This evolving landscape positions the automotive sector as a vital contributor to the overall growth trajectory of the IC carrier tape market.

Medical Devices:

The medical devices application segment represents a significant and growing avenue for the IC carrier tape market, propelled by the increasing adoption of electronics in healthcare. The rise of advanced medical technologies, such as diagnostic equipment, monitoring devices, and surgical instruments, necessitates robust packaging solutions to ensure the integrity of integrated circuits used in these applications. Carrier tapes designed for medical devices must adhere to stringent regulatory requirements, making reliability and safety paramount. As healthcare continues to evolve with innovations in telemedicine and wearable health devices, the demand for IC carrier tapes tailored for medical applications is poised for substantial growth, reflecting the industry's increasing reliance on electronics for improved patient outcomes.

Industrial:

In the industrial sector, the IC carrier tape market is gaining momentum due to the growing need for automation and smart technologies in manufacturing processes. With the increasing adoption of Industry 4.0 principles, manufacturers are increasingly utilizing sophisticated electronic components to enhance operational efficiency and productivity. Carrier tapes play a pivotal role in the packaging and handling of sensitive electronic parts used in industrial machinery and systems. Additionally, as industries seek to minimize downtime and streamline production lines, the demand for reliable and efficient packaging solutions such as IC carrier tapes is expected to rise. This trend highlights the importance of this segment in supporting the ongoing digital transformation within the industrial landscape.

Aerospace:

The aerospace application of IC carrier tapes is driven by the stringent requirements for reliability and performance in aerospace components. With the aerospace industry experiencing a surge in technological advancements and the incorporation of electronic systems in aircraft, packaging solutions must meet rigorous standards for safety and durability. IC carrier tapes are essential for protecting integrated circuits used in flight control systems, navigation, and communication devices. As the demand for more advanced and efficient aircraft continues to grow, the aerospace sector is expected to contribute significantly to the overall expansion of the IC carrier tape market, with manufacturers seeking innovative packaging solutions to ensure the integrity and performance of sensitive electronic components in challenging environments.

By Distribution Channel

Direct Sales:

Direct sales channels remain a critical aspect of the IC carrier tape market, allowing manufacturers to engage directly with customers and establish strong relationships. This approach enables manufacturers to provide tailored solutions that meet specific customer needs while offering a more personalized service experience. Direct sales are particularly advantageous for large-scale manufacturers and original equipment manufacturers (OEMs) that require customized solutions for their production processes. Additionally, direct sales channels facilitate quicker response times and improved communication, positioning manufacturers to effectively address market demands. As industries prioritize efficiency and collaboration, the direct sales model is expected to continue playing a significant role in the growth of the IC carrier tape market.

Distributor:

The distributor channel is essential for enhancing the IC carrier tape market's reach and accessibility, connecting manufacturers with a broader customer base across various industries. Distributors serve as intermediaries, facilitating the distribution of carrier tapes to end-users and ensuring that products are readily available in diverse geographical locations. This channel is particularly beneficial for smaller manufacturers or new entrants seeking to penetrate the market without establishing extensive sales networks. Distributors also provide valuable insights into market trends and customer preferences, enabling manufacturers to align their offerings with evolving demands. As the market continues to expand, the distributor channel will play a vital role in fostering collaboration and ensuring efficient supply chain management within the IC carrier tape industry.

By Material Type

PS:

Polystyrene (PS) is a widely used material type in the IC carrier tape market, known for its excellent mechanical properties and versatility. PS carrier tapes are favored for their lightweight nature and ability to accommodate various adhesive types, making them suitable for a range of packaging applications. The transparency of PS also allows for easy visibility of the enclosed components, ensuring that quality checks can be performed seamlessly. As the demand for consumer electronics, automotive parts, and medical devices continues to rise, the utilization of PS in carrier tapes is expected to remain significant, bolstered by its compatibility with advanced manufacturing techniques and processes.

PET:

Polyethylene Terephthalate (PET) is gaining popularity in the IC carrier tape market due to its excellent chemical resistance, mechanical strength, and dimensional stability. PET carrier tapes are particularly advantageous for applications requiring durability and reliability, such as in automotive and industrial sectors. The material's ability to withstand high temperatures and harsh environments makes it a preferred choice for packaging sensitive electronic components. As industries seek to enhance the performance and longevity of their products, the demand for PET-based carrier tapes is anticipated to grow. Additionally, the increasing focus on sustainability may further drive the adoption of PET materials, given their recyclability and lower environmental impact.

PC:

Polycarbonate (PC) is another important material type used in the IC carrier tape market, known for its robust impact resistance and high transparency. PC carrier tapes are particularly well-suited for applications where visibility of the packaged components is critical, such as in quality control processes. The strength and durability of PC materials enable them to protect integrated circuits from mechanical stress during transport and handling. As the electronics industry continues to evolve, with an increasing emphasis on advanced packaging solutions, the role of PC in carrier tapes is likely to expand, particularly in sectors demanding high-performance and reliable packaging solutions.

PVC:

Polyvinyl Chloride (PVC) is an established material in the IC carrier tape market, recognized for its flexibility and cost-effectiveness. PVC carrier tapes are commonly employed in various packaging applications due to their adaptability and ability to conform to different shapes and sizes. The material’s inherent properties allow for effective protection of sensitive electronic components during storage and transportation. While PVC faces competition from more advanced materials in certain applications, its affordability and widespread availability ensure its continued relevance in the market. As manufacturers seek to balance performance and cost, PVC carrier tapes are expected to maintain a steady presence in the IC carrier tape segment.

ABS:

Acrylonitrile Butadiene Styrene (ABS) is gaining traction in the IC carrier tape market as a material known for its excellent impact resistance and toughness. ABS carrier tapes are particularly beneficial for applications that require robust packaging solutions capable of withstanding challenging conditions during transport and handling. The versatility of ABS enables compatibility with various adhesive systems, enhancing its utility across different sectors. As industries increasingly prioritize durability and reliability in packaging, the adoption of ABS carrier tapes is likely to grow. Furthermore, the material's ease of processing and customization allows manufacturers to create tailored solutions that meet specific customer requirements, further supporting its market expansion.

By Region

North America is expected to maintain a significant share of the IC carrier tape market, driven by the region's advanced electronics and automotive industries. The increasing investments in research and development, coupled with a growing demand for sophisticated electronic devices and automotive applications, are contributing to the regional market's expansion. For instance, the North American IC carrier tape market is projected to grow at a CAGR of approximately 5.5% during the forecast period. The presence of established manufacturers and innovative startups in the region further supports the development of advanced packaging solutions, positioning North America as a key player in the global market.

Europe is also anticipated to witness substantial growth in the IC carrier tape market, fueled by the region's robust aerospace, automotive, and medical sectors. The increasing emphasis on advanced technologies and the integration of electronics in various applications are driving the demand for reliable packaging solutions. Countries such as Germany, France, and the United Kingdom are leading contributors to the market, with a strong focus on innovation and sustainability. The region's commitment to developing eco-friendly packaging materials is likely to bolster the adoption of water-based adhesive and recyclable carrier tapes, aligning with changing consumer preferences and regulatory requirements.

Opportunities

The IC carrier tape market is poised for numerous opportunities driven by technological advancements and an increasing focus on sustainability. As the demand for miniaturized electronic components continues to rise, manufacturers are seeking innovative packaging solutions that can enhance efficiency and protect integrated circuits during handling and transport. This trend opens avenues for developing advanced carrier tapes that incorporate smart features, such as RFID technology for inventory management and tracking. Additionally, the growing emphasis on environmentally friendly materials presents an opportunity for manufacturers to invest in research and development of biodegradable and recyclable carrier tapes, aligning with global sustainability goals and consumer preferences.

Furthermore, the expansion of emerging industries, particularly in the Asia Pacific region, offers significant potential for growth in the IC carrier tape market. Countries such as China, India, and South Korea are witnessing rapid advancements in electronics, automotive, and industrial sectors, creating a burgeoning demand for effective packaging solutions. Manufacturers can capitalize on these opportunities by establishing strategic partnerships and collaborations with local players and investing in production capabilities to cater to regional needs. As innovation continues to drive the market, the ability to adapt to changing industry requirements will be crucial for stakeholders to leverage the opportunities presented in the evolving landscape of the IC carrier tape market.

Threats

One of the primary threats facing the IC carrier tape market is the volatility of raw material prices, which can significantly affect production costs and profit margins for manufacturers. Fluctuations in the prices of materials such as plastics and adhesives may lead to unpredictability in the supply chain, resulting in increased operational challenges. Additionally, the growing trend toward automation and the development of advanced packaging technologies may pose challenges for traditional manufacturers who may struggle to adapt to the changing landscape. As the industry shifts toward more sophisticated solutions, companies that fail to keep pace with innovation risk losing market share to more agile and technologically advanced competitors.

Moreover, increasing environmental regulations and the rising demand for sustainable practices present both challenges and opportunities for the IC carrier tape market. While the shift toward eco-friendly materials can foster innovation, it may also necessitate significant investments in research and development and new manufacturing processes. Companies that are unable or unwilling to adapt to these changes may face regulatory hurdles and reputational risks, potentially limiting their growth prospects. The competitive landscape of the IC carrier tape market will require stakeholders to remain vigilant and proactive in addressing these threats while pursuing opportunities for sustainable growth and innovation.

Competitor Outlook

• 3M Company
• Henkel AG & Co. KGaA
• TE Connectivity Ltd.
• Adhesive Applications, Inc.
• Sumitomo Bakelite Co., Ltd.
• Toray Industries, Inc.
• Mitsui Chemicals, Inc.
• Intertape Polymer Group Inc.
• Nitto Denko Corporation
• Fujifilm Holdings Corporation
• Shin-Etsu Chemical Co., Ltd.
• Saint-Gobain S.A.
• Chomerics (Parker Hannifin Corporation)
• American Tape Company
• Scapa Group plc

The competitive landscape of the IC carrier tape market is characterized by a diverse range of players, including established multinational corporations and emerging companies. Key global manufacturers such as 3M Company, Henkel AG, and TE Connectivity have a strong presence in the market, with extensive portfolios of adhesive solutions and carrier tapes. These companies leverage their technological expertise and innovative capabilities to develop advanced products that cater to the evolving needs of various industries. Additionally, partnerships and collaborations among manufacturers, distributors, and end-users are increasingly common as stakeholders seek to enhance their value propositions and expand their market reach.

3M Company is a prominent player in the IC carrier tape market, known for its commitment to innovation and product development. The company offers a wide range of carrier tapes that cater to diverse applications, including consumer electronics and automotive components. With a strong emphasis on research and development, 3M continuously invests in new technologies and materials to enhance product performance and reliability. Similarly, Henkel AG operates in the adhesive solutions space, providing carrier tapes that meet stringent industry standards and regulatory requirements. The company's focus on sustainability and eco-friendly packaging solutions positions it well to capture emerging market opportunities, especially in regions prioritizing environmentally conscious practices.

TE Connectivity is another key competitor in the IC carrier tape market, recognized for its expertise in connectivity and sensor technology. The company offers a range of packaging solutions, including carrier tapes, designed to ensure the reliability and performance of electronic components. With a strong presence in the automotive and industrial sectors, TE Connectivity continues to innovate and develop products that address the growing demand for advanced packaging solutions. As the market evolves, players must remain agile and responsive to emerging trends, leveraging their strengths to navigate the competitive landscape effectively and capitalize on growth opportunities within the IC carrier tape market.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 3M Company
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Scapa Group plc
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Saint-Gobain S.A.
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Henkel AG & Co. KGaA
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 TE Connectivity Ltd.
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 American Tape Company
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Mitsui Chemicals, Inc.
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Toray Industries, Inc.
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 Nitto Denko Corporation
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Adhesive Applications, Inc.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Sumitomo Bakelite Co., Ltd.
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Intertape Polymer Group Inc.
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Shin-Etsu Chemical Co., Ltd.
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Fujifilm Holdings Corporation
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Chomerics (Parker Hannifin Corporation)
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 IC Carrier Tape Market, By Application
    • 6.1.1 Consumer Electronics
    • 6.1.2 Automotive
    • 6.1.3 Medical Devices
    • 6.1.4 Industrial
    • 6.1.5 Aerospace
  • 6.2 IC Carrier Tape Market, By Material Type
    • 6.2.1 PS
    • 6.2.2 PET
    • 6.2.3 PC
    • 6.2.4 PVC
    • 6.2.5 ABS
  • 6.3 IC Carrier Tape Market, By Distribution Channel
    • 6.3.1 Direct Sales
    • 6.3.2 Distributor

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 IC Carrier Tape Market by Region
  • 10.6 Middle East & Africa - Market Analysis
    • 10.6.1 By Country
      • 10.6.1.1 Middle East
      • 10.6.1.2 Africa

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global IC Carrier Tape market is categorized based on

By Application

• Consumer Electronics
• Automotive
• Medical Devices
• Industrial
• Aerospace

By Distribution Channel

• Direct Sales
• Distributor

By Material Type

• PS
• PET
• PC
• PVC
• ABS

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• 3M Company
• Henkel AG & Co. KGaA
• TE Connectivity Ltd.
• Adhesive Applications, Inc.
• Sumitomo Bakelite Co., Ltd.
• Toray Industries, Inc.
• Mitsui Chemicals, Inc.
• Intertape Polymer Group Inc.
• Nitto Denko Corporation
• Fujifilm Holdings Corporation
• Shin-Etsu Chemical Co., Ltd.
• Saint-Gobain S.A.
• Chomerics (Parker Hannifin Corporation)
• American Tape Company
• Scapa Group plc