High Density Interconnect

High Density Interconnect Market Outlook

The global High Density Interconnect (HDI) Market is estimated to reach a remarkable valuation of approximately USD 17 billion by 2035, exhibiting a compound annual growth rate (CAGR) of around 8.5% during the forecast period from 2025 to 2035. This growth can be attributed to the increasing demand for compact, lightweight, and high-performance electronic devices that require efficient interconnections. The rapid advancement in consumer electronics, telecommunications infrastructure, and automotive electronics is significantly driving the demand for HDI PCBs, which are essential for meeting the demands of modern technology. Additionally, the ongoing trends toward miniaturization and enhanced functionality in electronic assemblies are expected to further stimulate market growth. Furthermore, the proliferation of advanced technologies such as 5G networks and IoT devices are contributing to the rising applications for HDI solutions across various sectors.

Growth Factor of the Market

The growth of the High Density Interconnect market can be primarily attributed to the transformation within the electronic industry characterized by the demand for smaller and more efficient devices. With the rising adoption of smartphones, tablets, and wearables, manufacturers are compelled to develop compact circuit boards that allow for higher circuit density while maintaining reliability and performance. Moreover, the automotive industry's shift towards electric vehicles and advanced driver-assistance systems (ADAS) has created an insatiable demand for HDI solutions to support complex electronic functionalities, enhancing safety and automation. Additionally, advancements in manufacturing technologies, such as laser drilling and microvia technology, are improving the efficiency and cost-effectiveness of HDI PCB production, thereby making these solutions more accessible to a broader range of manufacturers. The healthcare sector's increasing reliance on sophisticated medical devices, which necessitate high-performance interconnection solutions, is also driving market growth. Furthermore, investments in telecommunications infrastructure worldwide to boost connectivity and bandwidth are further fueling the HDI market.

Key Highlights of the Market

• The market is projected to grow at a CAGR of 8.5% from 2025 to 2035.
• Consumer electronics is expected to dominate the application segment, driven by the demand for smartphones and smart devices.
• Technological advancements in PCB manufacturing processes are streamlining production efficiency.
• The automotive sector's transition to electric vehicles presents lucrative growth opportunities.
• Asia Pacific is anticipated to hold the largest market share, owing to the rapid expansion of the electronics manufacturing sector in countries like China, Japan, and South Korea.

By Product Type

Rigid HDI PCBs:

Rigid HDI PCBs are essential components in various electronic devices where durability and strength are critical. These boards are characterized by multiple layers of circuitry that can support advanced functionalities while maintaining compactness. The increasing need for lightweight and high-performance circuit boards in consumer electronics, telecommunications, and automotive applications is propelling the demand for rigid HDI PCBs. With advancements in materials and manufacturing techniques, these PCBs can now support higher circuit densities, enabling manufacturers to incorporate more features into smaller devices. Furthermore, the benefits of improved thermal management and reduced signal loss ensure that rigid HDI PCBs are integral in the development of next-generation electronic devices, thereby solidifying their position in the market.

Flex HDI PCBs:

Flex HDI PCBs offer a unique advantage due to their ability to bend and conform to various shapes and spaces, making them ideal for applications in challenging environments. These types of circuit boards are widely used in consumer electronics, medical devices, and automotive applications where flexibility and lightweight properties are essential. The growing trend towards miniaturization in electronic devices has led to an increased preference for flex HDI PCBs, as they allow for complex circuitry to be efficiently arranged in compact form factors. Additionally, advancements in flexible materials and manufacturing processes are enhancing the performance and reliability of these PCB types, thereby expanding their application scope. As industries continue to innovate, the demand for flex HDI PCBs is expected to rise significantly, further driving market growth.

Rigid-Flex HDI PCBs:

Rigid-Flex HDI PCBs combine the benefits of both rigid and flexible circuit boards, allowing for a versatile approach to electronic design. These boards are particularly valuable in applications where space is a constraint, and there is a need for more complex circuitry. Industries such as aerospace, automotive, and consumer electronics have embraced rigid-flex HDI PCBs due to their ability to provide innovative solutions that blend structural integrity with flexibility. As devices become more sophisticated, the requirement for high-density interconnections that can withstand dynamic environments is growing, fostering the demand for rigid-flex HDI PCBs. The evolving landscape of electronics is expected to drive innovation in this segment, leading to further advancements and adoption across various sectors.

Others:

This category encompasses various specialized HDI PCBs that do not fall under the conventional classifications but serve unique applications across different industries. These might include advanced PCBs designed for specific use in sectors such as defense, aerospace, and specialized industrial equipment. The increasing complexity and technological sophistication in these fields are driving the need for tailored HDI solutions that can accommodate specific requirements. In addition, the ongoing research and development efforts to create innovative interconnect technologies are expected to contribute to the growth of the 'Others' segment, as manufacturers seek to meet the evolving needs of various industries.

By Application

Consumer Electronics:

The consumer electronics sector represents a significant application area for HDI technology, primarily due to the rapid proliferation of devices such as smartphones, tablets, and wearable gadgets. As consumers demand more features and enhanced functionalities, manufacturers are compelled to develop products that are not only powerful but also compact and lightweight. HDI PCBs enable the integration of multiple functionalities in a limited space, which is crucial for modern electronic devices. The trend towards smart and connected devices further fuels the demand for advanced interconnect solutions, as they enhance device performance and user experience. Consequently, the consumer electronics application is expected to dominate the HDI market throughout the forecast period as manufacturers strive to innovate and meet consumer expectations.

Telecommunications:

The telecommunications sector is experiencing rapid growth, driven by the increasing demand for high-speed internet and mobile connectivity. HDI PCBs play an indispensable role in supporting the infrastructure required for telecommunications systems, including routers, switches, and base stations. The advent of 5G technology is a key driver in this sector, as it necessitates the development of advanced telecommunications equipment capable of handling higher data rates and lower latency. HDI solutions provide the necessary density and performance required for complex telecommunications systems, ensuring reliable and efficient signal transmission. As the demand for robust telecommunications infrastructure continues to grow, so too will the need for high-density interconnect solutions in this sector.

Automotive:

The automotive industry is undergoing a transformation, particularly with the rise of electric and autonomous vehicles, which require a vast array of electronic systems for operation, safety, and convenience. HDI PCBs are critical in supporting these advanced functionalities, including infotainment systems, navigation, and driver-assistance technologies. The increasing emphasis on vehicle connectivity and the incorporation of sophisticated sensors necessitate the use of high-density interconnect solutions to ensure optimal performance and reliability. As manufacturers focus on improving vehicle technology and enhancing the driving experience, the demand for HDI PCBs in the automotive sector is projected to grow significantly over the next decade.

Healthcare:

The healthcare sector is increasingly adopting advanced electronic solutions to improve patient care and streamline operations. HDI PCBs play a pivotal role in medical devices, imaging equipment, and monitoring systems, where high reliability and performance are paramount. The rise in telehealth services and the need for portable medical devices have led to a growing demand for compact and efficient HDI solutions. Additionally, the ongoing advancements in medical technology, including the development of interconnected devices for remote monitoring and diagnostics, are further driving the need for high-density interconnects. As the healthcare industry continues to innovate, the significance of HDI PCBs will only escalate, making it a vital application area for market growth.

Industrial:

Industrial applications encompass a wide range of sectors, including automation, robotics, and process control, where reliable and effective electronic components are essential. HDI PCBs are increasingly being utilized in these applications due to their ability to handle complex circuitry and provide robust performance in demanding environments. The growing trend toward Industry 4.0, which emphasizes automation and data exchange in manufacturing technologies, is further propelling the demand for advanced HDI solutions. As industrial systems become more sophisticated and interconnected, the need for high-density interconnects that can support these advancements is expected to rise significantly, enhancing the overall operational efficiency and reliability of industrial applications.

By User

OEMs:

Original Equipment Manufacturers (OEMs) serve as a critical segment within the HDI market as they design and produce a wide variety of electronic devices across different applications. The growing trend of miniaturization in electronics is driving OEMs to seek advanced HDI solutions that can meet the requirements for higher performance and functionality in smaller form factors. OEMs are increasingly adopting HDI technology in their products, ranging from consumer electronics to automotive components, to remain competitive in the market. As the demand for innovative and reliable electronic devices continues to rise, the role of OEMs in the HDI market is expected to expand, fostering further growth in this segment.

EMS Providers:

Electronics Manufacturing Services (EMS) providers play an essential role in the HDI market by offering outsourced manufacturing services to OEMs. As the electronics industry continues to evolve, EMS providers are increasingly adopting HDI technology to meet the growing demand for high-density interconnect solutions. These providers are focused on enhancing production efficiency while maintaining high-quality standards, enabling them to support OEMs in their quest for innovation. The growing trend of outsourcing manufacturing processes to EMS providers is expected to solidify their position in the HDI market, as they invest in advanced technologies and capabilities to satisfy the demands of diverse industries.

By Technology

Sequential Lamination:

Sequential lamination is a widely adopted technology in the production of HDI PCBs, characterized by the layer-by-layer building of circuit boards. This method enables manufacturers to create complex designs and high-density layouts while maintaining precision and reliability. The increasing complexity of electronic devices necessitates the use of sequential lamination technology, as it allows for more intricate designs that can accommodate multiple functionalities within a compact form factor. With advancements in manufacturing processes that enhance efficiency and reduce production costs, the sequential lamination technique is expected to gain further traction in the HDI market.

Any Layer HDI:

The Any Layer HDI technology provides manufacturers with the flexibility to access any layer of the PCB for routing signals, making it suitable for high-density designs. This technology allows for enhanced functionality and performance in complex circuit boards, enabling manufacturers to optimize the layout for specific applications. As the demand for advanced electronics continues to rise, Any Layer HDI technology is becoming increasingly relevant in the market, especially for applications that require high-speed signal transmission and reduced electromagnetic interference. This adaptability and performance capability make Any Layer HDI a favored choice among manufacturers in the high-density interconnect market.

Stacked Microvias:

Stacked microvias technology has emerged as a critical innovation in the HDI market, allowing for the construction of high-density interconnects within limited space. This technique involves stacking multiple microvias to connect different layers of the PCB, facilitating complex routing paths and supporting high-speed applications. As electronic devices become smaller and more sophisticated, the need for advanced interconnection solutions like stacked microvias is escalating. This technology not only enhances circuit density but also improves manufacturing efficiency, positioning it as a key driver of growth within the HDI market.

Laser Drilled HDI:

Laser drilled HDI technology is revolutionizing the PCB manufacturing process by offering precision drilling capabilities that enable the creation of smaller vias with intricate designs. This technique enhances the overall performance of PCBs by ensuring reliable signal transmission and minimizing losses. The growing trend of miniaturization in electronic products has significantly increased the demand for laser drilled HDI solutions, allowing manufacturers to produce compact designs with high circuit density. As laser technology continues to advance, its implications for the HDI market will likely lead to increased efficiency and improved product quality.

Others:

This category includes various innovative technologies and methods utilized in the production of HDI PCBs that don't specifically fall under the previously mentioned classifications. As electronic manufacturing evolves, new techniques are being developed to address the emerging challenges associated with high-density interconnects. These innovations are facilitating enhanced performance, reliability, and manufacturability of HDI solutions. The continuous evolution of technologies within the 'Others' segment is indicative of the ongoing drive for excellence in the HDI market, ensuring manufacturers can meet the diverse and dynamic needs of modern electronics.

By Region

In terms of regional analysis, the High Density Interconnect market is anticipated to witness significant growth across various regions, with Asia Pacific holding the largest market share. This region is projected to account for nearly 45% of the global market by 2035, driven by the rapid expansion of the electronics manufacturing sector in countries like China, Japan, and South Korea. The increasing investments in semiconductor manufacturing and the growing adoption of HDI technology in consumer electronics, telecommunications, and automotive applications are primary contributors to this growth. Furthermore, Asia Pacific is expected to experience a CAGR of 9% during the forecast period, indicating a strong trajectory for HDI solutions in the region.

North America and Europe are also expected to play a significant role in the HDI market, accounting for approximately 25% and 20% of the global market share, respectively. The growth in these regions is primarily fueled by the increasing adoption of advanced electronic systems in various applications, including healthcare and automotive. North America, specifically, is witnessing rising demand for HDI solutions driven by the telecommunications sector's need for enhanced connectivity solutions, especially with the rollout of 5G networks. In contrast, Europe is focused on innovation in automotive and industrial applications, further solidifying its position in the HDI market. The interplay of technological advancements and market demands in these regions is anticipated to foster a healthy competitive environment, contributing positively to the overall growth of the HDI market.

Opportunities

The High Density Interconnect market presents numerous opportunities driven by emerging technologies and the growing demand for advanced electronic devices. One of the most promising areas for growth is the automotive sector, particularly with the proliferation of electric vehicles (EVs) and autonomous driving technologies. As automakers increasingly integrate sophisticated electronic systems into their vehicles to enhance safety, connectivity, and performance, the demand for HDI solutions will continue to rise. Furthermore, the expansion of smart cities and the Internet of Things (IoT) initiatives is creating new avenues for HDI applications, as these technologies rely heavily on compact and efficient interconnect solutions for seamless connectivity and data processing. As industries evolve and innovate, the HDI market is well-positioned to capitalize on these emerging trends, presenting lucrative opportunities for manufacturers and service providers alike.

Another significant opportunity lies in the healthcare sector, where the demand for advanced medical devices and diagnostic equipment is on the rise. The ongoing development of telehealth and remote monitoring solutions is driving the need for reliable and high-performance HDI solutions in medical applications. As healthcare technology continues to advance, manufacturers will require sophisticated interconnect solutions to facilitate the integration of various functionalities into compact devices, enhancing patient care and operational efficiency. Moreover, the increasing adoption of wearable health monitoring devices presents additional prospects for HDI solutions, as these devices demand high-density circuitry in a small form factor. By tapping into these emerging opportunities across sectors, players in the HDI market can unlock growth potential and establish a competitive edge.

Threats

Despite the growth prospects in the High Density Interconnect market, there are significant threats that could hinder market expansion. One of the primary concerns is the rapid pace of technological change, which can outpace the capabilities of existing HDI solutions. Manufacturers must continuously innovate and adapt to meet the evolving demands of various industries, and any delays or inability to keep up with new technological advancements may result in lost market share to competitors. Additionally, global supply chain disruptions, as seen during the pandemic, can negatively impact the availability of raw materials and components necessary for HDI production, leading to increased costs and production delays. Furthermore, fluctuations in the prices of raw materials, particularly in the semiconductor industry, could pose challenges for manufacturers in maintaining profitability while providing competitive pricing.

Another potential threat to the HDI market is the growing trend towards alternative technologies and materials that may offer comparable performance at a lower cost. For instance, the development of new interconnect technologies and materials could lead to the emergence of competitors that challenge the dominance of traditional HDI solutions. Additionally, environmental regulations concerning electronic waste and sustainability may prompt manufacturers to rethink their production processes and materials, potentially impacting the availability and adoption of HDI solutions. The combination of these factors necessitates continuous vigilance and strategic planning by market players to navigate the evolving landscape and mitigate potential risks effectively.

Competitor Outlook

• AT&S
• Unimicron Technology Corporation
• Shenzhen Fastprint Circuit Tech Co., Ltd.
• Jabil Inc.
• TTM Technologies, Inc.
• Millennium Circuit Technology
• HannStar Board Corporation
• PCB Technologies
• Kyocera Corporation
• Cirexx International
• Plexus Corp.
• Eltek Ltd.
• Wus Printed Circuit Co., Ltd.
• Compeq Manufacturing Co., Ltd.
• Advanced Circuits

The competitive landscape of the High Density Interconnect market is characterized by a diverse range of players, each vying for a share in this rapidly evolving industry. Major manufacturers are focusing on innovation and advancements in technology to differentiate their offerings. Companies like AT&S and Unimicron Technology Corporation lead the market, leveraging their extensive manufacturing capabilities and expertise in advanced PCB technologies. These market leaders are investing heavily in research and development to develop next-generation HDI solutions that can accommodate the latest electronic applications while enhancing performance and reliability. The competitive environment is further intensified by the presence of emerging players who are adopting innovative manufacturing techniques and focusing on niche markets, which contributes to a dynamic landscape.

Jabil Inc. and TTM Technologies, Inc. are also notable players in the HDI market, providing comprehensive electronic manufacturing services that cater to a wide array of industries. These companies are enhancing their capabilities through strategic partnerships and collaborations, allowing them to expand their service offerings and improve their market reach. Furthermore, the increasing focus on sustainability and environmentally friendly manufacturing processes is becoming a central theme among competitors, leading to the development of HDI solutions that meet regulatory standards while minimizing environmental impact. As competition heightens, companies are increasingly looking to differentiate their products not only through performance but also through responsible manufacturing practices.

In addition to these major players, several smaller companies are making significant strides in the HDI market by offering specialized solutions tailored to specific applications. For instance, firms like Millennium Circuit Technology and Cirexx International are focusing on developing HDI solutions for niche segments within the automotive and healthcare industries, where high-performance and reliability are critical. These companies leverage their agility and specialization to address the unique needs of their customers, competing effectively against larger manufacturers. The overall competitive landscape of the HDI market is expected to experience continuous transformation, driven by technological advancements, shifting market demands, and the ongoing pursuit of innovation among industry players.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 AT&S
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Eltek Ltd.
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Jabil Inc.
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Plexus Corp.
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 PCB Technologies
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Advanced Circuits
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Kyocera Corporation
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Cirexx International
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 TTM Technologies, Inc.
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 HannStar Board Corporation
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Millennium Circuit Technology
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Wus Printed Circuit Co., Ltd.
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Compeq Manufacturing Co., Ltd.
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Unimicron Technology Corporation
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Shenzhen Fastprint Circuit Tech Co., Ltd.
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 High Density Interconnect Market, By Technology
    • 6.1.1 Sequential Lamination
    • 6.1.2 Any Layer HDI
    • 6.1.3 Stacked Microvias
    • 6.1.4 Laser Drilled HDI
    • 6.1.5 Others
  • 6.2 High Density Interconnect Market, By Application
    • 6.2.1 Consumer Electronics
    • 6.2.2 Telecommunications
    • 6.2.3 Automotive
    • 6.2.4 Healthcare
    • 6.2.5 Industrial
    • 6.2.6 Others
  • 6.3 High Density Interconnect Market, By Product Type
    • 6.3.1 Rigid HDI PCBs
    • 6.3.2 Flex HDI PCBs
    • 6.3.3 Rigid-Flex HDI PCBs
    • 6.3.4 Others

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Middle East & Africa - Market Analysis
    • 10.5.1 By Country
      • 10.5.1.1 Middle East
      • 10.5.1.2 Africa
  • 10.6 High Density Interconnect Market by Region

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global High Density Interconnect market is categorized based on

By Product Type

• Rigid HDI PCBs
• Flex HDI PCBs
• Rigid-Flex HDI PCBs
• Others

By Application

• Consumer Electronics
• Telecommunications
• Automotive
• Healthcare
• Industrial
• Others

By Technology

• Sequential Lamination
• Any Layer HDI
• Stacked Microvias
• Laser Drilled HDI
• Others

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• AT&S
• Unimicron Technology Corporation
• Shenzhen Fastprint Circuit Tech Co., Ltd.
• Jabil Inc.
• TTM Technologies, Inc.
• Millennium Circuit Technology
• HannStar Board Corporation
• PCB Technologies
• Kyocera Corporation
• Cirexx International
• Plexus Corp.
• Eltek Ltd.
• Wus Printed Circuit Co., Ltd.
• Compeq Manufacturing Co., Ltd.
• Advanced Circuits