CMP Abrasive Material

CMP Abrasive Material Market Outlook

The global CMP abrasive material market is projected to reach USD 3.56 billion by 2033, growing at a CAGR of 7.2% during the forecast period from 2025 to 2033. This growth is primarily driven by the increasing demand for advanced abrasive materials in semiconductor manufacturing and electronics, where precision and efficiency are crucial. Additionally, the continuous evolution of technology in the automotive and optics industries is further propelling the demand for CMP abrasives. The rise of electric vehicles and their associated manufacturing processes necessitate the use of high-performance materials, thereby boosting the market. Moreover, with the ongoing trend of miniaturization in electronic devices, the need for more refined and effective abrasive materials cannot be overstated, presenting significant opportunities for growth.

Growth Factor of the Market

Several factors contribute to the robust growth of the CMP abrasive material market. The rising application of CMP techniques in the semiconductor manufacturing sector stands at the forefront, as manufacturers seek methods to produce smoother surfaces for integrated circuits. Furthermore, the continual advancement of nanotechnology and microfabrication processes requires increasingly sophisticated abrasive materials, which enhances performance while minimizing damage to delicate substrates. Another significant driver is the growing demand for high-quality optics, where precision abrasives are needed for polishing lenses and other optical components. In addition, the automotive sector is undergoing a transformation, with a shift towards electric vehicles and advanced driver-assistance systems (ADAS), necessitating advanced abrasive materials for various applications. Lastly, the increasing trend of online purchasing and the expansion of distribution channels are making these materials more accessible to end-users, thus further stimulating market growth.

Key Highlights of the Market

• The CMP abrasive material market is projected to grow at a CAGR of 7.2% from 2025 to 2033.
• Silicon carbide and aluminum oxide are anticipated to dominate the product type segment due to their superior performance in various applications.
• The semiconductor manufacturing application segment is expected to account for the largest share of the market, driven by the growing demand for high-tech electronics.
• Online retail channels are increasingly favored by consumers, contributing to a shift in purchasing dynamics within the industry.
• Asia Pacific is anticipated to witness the highest growth rate during the forecast period, propelled by rapid industrialization and advancements in technology.

By Product Type

Silicon Carbide:

Silicon carbide (SiC) is a key player in the CMP abrasive material market, recognized for its exceptional hardness and thermal conductivity. SiC abrasives are extensively used in semiconductor and electronic applications due to their ability to achieve high surface quality and low defect rates. They are particularly favored for polishing silicon wafers and other materials used in the electronics industry. The increasing complexity of semiconductor devices, which often require ultra-smooth surfaces for optimal performance, further bolsters the demand for silicon carbide. Additionally, the growth of electric vehicle technology, which heavily relies on silicon carbide for power devices, presents significant opportunities for expansion in this segment.

Aluminum Oxide:

Aluminum oxide, another widely used CMP abrasive material, offers excellent durability and versatility. Its chemical stability and resistance to wear make it suitable for a variety of applications, including semiconductor manufacturing, optics, and automotive components. Aluminum oxide abrasives are typically employed in slurry forms for efficient material removal and surface finishing. The segment is expected to witness substantial growth due to its cost-effectiveness and availability in different grades, catering to diverse polishing needs. As the automotive industry embraces advanced manufacturing techniques, the demand for aluminum oxide abrasives for surface preparation and finishing processes is set to increase significantly.

Cerium Oxide:

Cerium oxide is renowned for its polishing capabilities, particularly in the optics sector. It is commonly used to polish glass and other hard surfaces, making it an essential material in the CMP process for optical devices. Cerium oxide abrasives provide excellent surface finish and clarity, which are critical in the manufacturing of high-quality lenses and optical components. The rising demand for optical devices, coupled with advancements in display technologies, is expected to drive the growth of cerium oxide in the CMP abrasive material market. Its unique properties also contribute to its application in various electronics and automotive industries, where precision polishing is required.

Diamond:

Diamond abrasives are recognized for their unmatched hardness and are primarily utilized in high-performance applications where other abrasive materials may fall short. In the CMP abrasive material market, diamond is often used for polishing hard materials like ceramics and advanced composites, which are increasingly employed in aerospace and automotive industries. The demand for diamond abrasives is anticipated to grow due to their effectiveness in achieving superior surface finishes and their longer lifespan compared to traditional materials. As industries shift towards the use of advanced materials that require precise machining, diamond abrasives are likely to see expanded usage.

Others:

The "Others" segment encompasses various abrasive materials such as garnet, silicon nitride, and boron carbide. Though these materials may not dominate the market, they serve niche applications where specific properties are required. For instance, garnet is often utilized in waterjet cutting and surface preparation due to its eco-friendliness and efficiency. Similarly, silicon nitride is gaining traction in advanced ceramics and aerospace applications. As industries continue to evolve and seek specialized performance attributes, the demand for these alternative abrasive materials is expected to grow, adding diversity to the CMP abrasive material market.

By Application

Semiconductor Manufacturing:

The semiconductor manufacturing sector is the largest application segment for CMP abrasive materials, driven by the relentless demand for faster and more efficient electronic devices. The CMP process is critical for achieving the desired flatness and smoothness of silicon wafers used in integrated circuits. As the industry moves towards ever-shrinking technology nodes, the requirements for precision abrasives have intensified. Additionally, the proliferation of consumer electronics and the rise of Internet of Things (IoT) devices further amplify the need for advanced semiconductor manufacturing processes, thereby propelling the growth of the CMP abrasive material market in this segment.

Optics:

The optics application segment is gaining momentum, as high-quality optical devices require exceptional surface finishes achievable through CMP processes. Cerium oxide and diamond abrasives are predominantly used in this field, where polishing lenses and mirrors is essential. The increasing demand for optical components in telecommunications, automotive, and medical devices is driving the growth of this segment. Moreover, advancements in display technologies, such as OLED and microLED, require precise abrasive materials for their fabrication, positively impacting the CMP abrasive material market within the optics sector.

Electronics:

The electronics application segment is closely aligned with the semiconductor sector, as it encompasses a wide range of components that require high-quality surface finishes. CMP abrasive materials are critical for polishing process materials used in printed circuit boards (PCBs), capacitors, and other electronic components. As the global demand for consumer electronics continues to rise, particularly in the wake of increased remote work and digital connectivity, the need for efficient and effective CMP processes becomes more pronounced. This growth is further fueled by the ongoing miniaturization trend, which demands precise and high-quality finishes that CMP abrasive materials can deliver.

Automotive:

The automotive industry is undergoing a transformative phase with the rapid adoption of electric vehicles (EVs) and advanced driver-assistance systems (ADAS). These innovations necessitate high-precision components that require superior surface finishes achievable through the CMP process. CMP abrasive materials are increasingly used in the manufacturing of various automotive parts, including sensors, batteries, and motor components. As the automotive sector continues to evolve, the demand for CMP abrasives is expected to grow, driven by the need for advanced materials and manufacturing processes that enhance vehicle performance and safety.

Others:

The "Others" application segment encompasses various industries that utilize CMP abrasive materials for specific purposes. This includes aerospace, medical devices, and energy sectors, where high-quality surface finishes are critical for performance and safety. For instance, in the aerospace industry, components require precision machining to withstand extreme conditions. Additionally, the medical device sector demands stringent quality standards, where CMP abrasives play a vital role in ensuring the reliability and efficacy of products. As diverse industries recognize the benefits of using CMP abrasive materials for specific applications, this segment is anticipated to experience steady growth.

By Distribution Channel

Direct Sales:

Direct sales remain a significant distribution channel in the CMP abrasive material market, as many manufacturers prefer to engage directly with their customers to understand specific needs and provide tailored solutions. This approach allows companies to establish strong relationships with clients and ensure that the products meet the exact requirements of different applications. Direct sales also enable manufacturers to offer comprehensive support and services, which enhances customer satisfaction. Additionally, the growing trend of customization in industrial materials has led more customers to seek direct interactions with suppliers, further reinforcing the importance of direct sales in this sector.

Online Retail:

The rise of e-commerce has transformed the purchasing landscape for CMP abrasive materials, making online retail an increasingly popular distribution channel. This trend is driven by the convenience and accessibility that online platforms provide to customers looking to procure abrasive materials quickly and efficiently. Manufacturers and distributors are establishing robust online presences, allowing customers to explore a wide range of products, compare prices, and read reviews before making purchasing decisions. The ability to purchase materials online not only saves time but also broadens the customer base for manufacturers, leading to an expansion of market reach and engagement with end-users.

Distributors:

Distributors play a vital role in the CMP abrasive material market by acting as intermediaries between manufacturers and end-users. They often have established networks and extensive knowledge of various applications, which can help customers choose the right materials for their needs. Distributors typically stock a range of products, allowing them to offer quick delivery and a wide selection to their clients. As the demand for CMP abrasives grows, distributors are increasingly adapting to market trends, ensuring they stay competitive by providing high-quality products and excellent customer service.

Wholesalers:

Wholesalers also contribute significantly to the distribution of CMP abrasive materials. They typically purchase large quantities of products from manufacturers and sell them in bulk to retailers or smaller entities. This model helps to drive down costs and make abrasive materials more accessible to a broader audience. Wholesalers often have close ties with manufacturers, enabling them to provide competitive pricing and timely deliveries. As the market expands and evolves, wholesalers are likely to continue playing a crucial role in facilitating the distribution of CMP abrasives across various industries.

Others:

The "Others" distribution channel segment includes various unconventional methods through which CMP abrasive materials are sold. This could involve niche suppliers, local markets, or even collaborations with manufacturers that allow for unique purchasing agreements. As the market evolves, these alternative distribution channels may gain prominence, catering to specific requirements of customers in different industries. The flexibility and adaptability of these channels can offer valuable opportunities for manufacturers and suppliers to reach new customers and expand their market presence.

By Ingredient Type

Abrasive Particles:

Abrasive particles are foundational components in the CMP abrasive material market, providing the essential cutting action necessary for effective material removal and surface finishing. Common materials used as abrasive particles include silicon carbide, aluminum oxide, and diamond, each offering unique properties suited for various applications. These particles are typically combined with other components to create effective slurries or pads for specific polishing processes. The demand for high-quality abrasive particles is expected to grow as industries pursue enhanced performance and efficiency in their manufacturing processes.

Slurry:

Slurries are an essential form of CMP abrasive materials, consisting of abrasive particles suspended in a liquid medium. They are widely used in semiconductor manufacturing and optics to achieve high-quality surface finishes. Slurries facilitate efficient polishing by providing uniform coverage and allowing for precise control over the polishing process. The growing complexity of materials and substrates in advanced manufacturing is driving the demand for specialized slurries that can meet specific performance criteria. As technology continues to advance, the slurry segment is expected to witness significant growth, driven by innovations in formulation and application techniques.

Pads:

Polishing pads are another critical component in the CMP abrasive material market, serving as the interface between the abrasive material and the workpiece. Pads are typically made from soft materials that can conform to the surface being polished while providing a medium for the abrasive particles to operate effectively. The choice of pad material and design can significantly impact the polishing process's efficiency and effectiveness. As industries seek improved performance from their CMP processes, the demand for high-quality polishing pads is anticipated to rise, with innovations in materials and design leading to more effective solutions.

Abrasive Discs:

Abrasive discs are widely used in various applications for surface preparation and finishing. They are often made from coated abrasives that provide effective material removal for different substrates. In the CMP abrasive material market, abrasive discs are utilized in several industries, including automotive and electronics. The versatility of abrasive discs makes them suitable for a range of applications, contributing to their demand. As the need for efficient surface finishing processes increases, the role of abrasive discs in the market is expected to grow, driven by advancements in materials and manufacturing techniques.

Others:

The "Others" ingredient type segment includes additional components used in CMP abrasive formulations. This can encompass specialized additives that enhance the performance of the abrasives, improve dispersion in slurries, or modify the polishing characteristics of pads and discs. These ingredient types are essential for ensuring that the final CMP products meet the specific requirements of various applications. As technology continues to evolve, the demand for innovative formulations incorporating unique ingredient types is expected to increase, leading to advancements in the CMP abrasive material market.

By Region

The Asia Pacific region is anticipated to witness the highest growth rate in the CMP abrasive material market, driven by rapid industrialization and the expansion of the semiconductor and electronics industries. Countries such as China, Japan, and South Korea are at the forefront of technological advancements, with significant investments in semiconductor manufacturing and electronic components production. The region's market size is projected to expand significantly, fueled by the increasing demand for high-performance materials in various applications. Additionally, the ongoing development of electric vehicles and renewable energy technologies will further contribute to the growth of the CMP abrasive material market in Asia Pacific.

North America, with a significant market share, is also expected to experience steady growth in the CMP abrasive material market. The presence of major semiconductor manufacturers and electronics companies, coupled with continuous advancements in technology, will drive demand in this region. The North American market is projected to grow at a CAGR of approximately 6.5% during the forecast period, reflecting the region's commitment to innovation and high-quality manufacturing processes. Europe, while maintaining a robust market presence, is expected to see moderate growth due to its strong automotive and optics sectors, which will continue to require advanced CMP abrasive materials for high-precision applications.

Opportunities

The CMP abrasive material market presents numerous opportunities for growth and innovation, particularly in the rapidly evolving semiconductor and electronics sectors. As technology advances, manufacturers are increasingly seeking high-performance abrasives that can accommodate the demands of smaller and more complex devices. This shift opens the door for companies to develop specialized abrasive materials that cater to specific applications, such as advanced packaging, optical components, and precision machining. Furthermore, the trend toward sustainability and eco-friendly manufacturing practices is creating opportunities for the development of green abrasive materials that minimize environmental impact while delivering effective performance. Companies that adapt to these trends and invest in research and development are likely to capture a significant share of the expanding market.

Another promising opportunity lies in the growing demand for electric vehicles and renewable energy technologies. As these industries expand, the need for advanced manufacturing processes, including CMP techniques, will increase. This creates an avenue for CMP abrasive material suppliers to provide innovative solutions tailored to the unique requirements of the automotive and energy sectors. Additionally, the ongoing digital transformation within manufacturing processes offers opportunities for companies to leverage data analytics and artificial intelligence to enhance their product offerings and optimize their supply chains. By embracing these advancements, suppliers can position themselves as leaders in the CMP abrasive material market, catering to the evolving needs of diverse industries.

Threats

Despite the promising growth prospects of the CMP abrasive material market, several threats could impede its expansion. One significant challenge is the volatility of raw material prices, which can impact production costs and, consequently, pricing strategies for manufacturers. Fluctuations in the availability of key raw materials, such as silicon carbide and aluminum oxide, can lead to supply chain disruptions and affect the overall market dynamics. Additionally, competition from alternative surface finishing technologies, such as laser processing and chemical etching, presents a challenge for traditional CMP processes. As these alternatives gain traction, there may be a shift in demand away from CMP abrasives, necessitating adaptation and innovation from suppliers to maintain market relevance.

Another critical threat to the CMP abrasive material market stems from the rapid pace of technological advancements, which consistently push manufacturers to evolve their products to remain competitive. Companies that fail to keep up with these changes may risk losing market share to more agile competitors. Furthermore, regulatory pressures regarding environmental sustainability and workplace safety can impose additional challenges, requiring manufacturers to adapt their processes and materials to comply with stricter standards. Failure to address these regulatory concerns could result in potential legal liabilities and reputational damage, emphasizing the importance of proactive risk management in the CMP abrasive material market.

Competitor Outlook

• 3M Company
• Saint-Gobain Abrasives
• Dow Inc.
• Fujimi Incorporated
• Cabot Microelectronics Corporation
• AMETEK, Inc.
• DuPont de Nemours, Inc.
• Micro Abrasives Corporation
• Kemet International Ltd.
• Klingspor Abrasives, Inc.
• Wacker Chemie AG
• Asahi Diamond Industrial Co., Ltd.
• Pferd Inc.
• Widenmann GmbH
• Shin-Etsu Chemical Co., Ltd.

The CMP abrasive material market's competitive landscape is characterized by a mix of established players and emerging companies, each vying for market share amid rapid technological advancements and shifting customer demands. Prominent manufacturers like 3M Company and Saint-Gobain Abrasives leverage their extensive product portfolios and global distribution networks to maintain a strong market presence. These companies continually invest in research and development to create innovative abrasive materials that meet the evolving needs of semiconductor, optics, and automotive industries. Their ability to develop high-performance products while ensuring sustainability positions them favorably in a competitive market.

Cabot Microelectronics Corporation and Fujimi Incorporated are also significant competitors in the CMP abrasive material market, with a strong focus on serving the semiconductor industry. These companies have established themselves as leaders in providing tailored solutions for wafer polishing applications, which are critical to the semiconductor manufacturing process. Their commitment to innovation and customer-centric approaches enables them to adapt to the rapidly changing landscape, ensuring they remain competitive against emerging players. Additionally, the growing prominence of online retail channels has prompted these firms to strengthen their digital presence, allowing them to reach a broader customer base and enhance customer engagement.

New entrants and smaller players in the CMP abrasive material market are increasingly focused on niche applications and specialized formulations, often targeting specific industry requirements. These companies may offer unique product offerings that cater to the growing demand for sustainable and environmentally friendly abrasives. As competition intensifies, established players will need to remain vigilant and responsive to emerging trends to maintain their competitive edge. The market's dynamic nature underscores the importance of innovation, adaptability, and collaboration among key stakeholders to navigate challenges and capitalize on growth opportunities.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 Dow Inc.
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 3M Company
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Pferd Inc.
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 AMETEK, Inc.
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 Widenmann GmbH
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Wacker Chemie AG
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Fujimi Incorporated
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Saint-Gobain Abrasives
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 DuPont de Nemours, Inc.
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 Kemet International Ltd.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Klingspor Abrasives, Inc.
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Micro Abrasives Corporation
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 Shin-Etsu Chemical Co., Ltd.
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Asahi Diamond Industrial Co., Ltd.
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Cabot Microelectronics Corporation
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 CMP Abrasive Material Market, By Application
    • 6.1.1 Semiconductor Manufacturing
    • 6.1.2 Optics
    • 6.1.3 Electronics
    • 6.1.4 Automotive
    • 6.1.5 Others
  • 6.2 CMP Abrasive Material Market, By Product Type
    • 6.2.1 Silicon Carbide
    • 6.2.2 Aluminum Oxide
    • 6.2.3 Cerium Oxide
    • 6.2.4 Diamond
    • 6.2.5 Others
  • 6.3 CMP Abrasive Material Market, By Ingredient Type
    • 6.3.1 Abrasive Particles
    • 6.3.2 Slurry
    • 6.3.3 Pads
    • 6.3.4 Abrasive Discs
    • 6.3.5 Others
  • 6.4 CMP Abrasive Material Market, By Distribution Channel
    • 6.4.1 Direct Sales
    • 6.4.2 Online Retail
    • 6.4.3 Distributors
    • 6.4.4 Wholesalers
    • 6.4.5 Others

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 CMP Abrasive Material Market by Region
  • 10.6 Middle East & Africa - Market Analysis
    • 10.6.1 By Country
      • 10.6.1.1 Middle East
      • 10.6.1.2 Africa

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global CMP Abrasive Material market is categorized based on

By Product Type

• Silicon Carbide
• Aluminum Oxide
• Cerium Oxide
• Diamond
• Others

By Application

• Semiconductor Manufacturing
• Optics
• Electronics
• Automotive
• Others

By Distribution Channel

• Direct Sales
• Online Retail
• Distributors
• Wholesalers
• Others

By Ingredient Type

• Abrasive Particles
• Slurry
• Pads
• Abrasive Discs
• Others

By Region

• Asia Pacific
• North America
• Europe
• Latin America
• Middle East & Africa

Key Players

• 3M Company
• Saint-Gobain Abrasives
• Dow Inc.
• Fujimi Incorporated
• Cabot Microelectronics Corporation
• AMETEK, Inc.
• DuPont de Nemours, Inc.
• Micro Abrasives Corporation
• Kemet International Ltd.
• Klingspor Abrasives, Inc.
• Wacker Chemie AG
• Asahi Diamond Industrial Co., Ltd.
• Pferd Inc.
• Widenmann GmbH
• Shin-Etsu Chemical Co., Ltd.