Chip Handler in Semiconductor

Chip Handler in Semiconductor Market Outlook

The global semiconductor chip handler market is projected to reach a valuation of approximately USD 1.5 billion by 2035, growing at a compound annual growth rate (CAGR) of about 6.8% during the forecast period from 2025 to 2035. This growth is driven by the increasing demand for advanced semiconductor packaging technologies, the need for efficient automation in manufacturing processes, and the rising adoption of semiconductor devices in various sectors, including consumer electronics and automotive industries. Furthermore, the emergence of 5G technology and the Internet of Things (IoT) applications are significantly contributing to the demand for chip handlers, as they enable faster data processing and improved performance of integrated circuits. Another crucial factor propelling the market is the ongoing trend towards miniaturization of electronic components, which requires sophisticated handling solutions to ensure precision and reliability in production lines.

Growth Factor of the Market

Several key factors are driving the growth of the semiconductor chip handler market. Firstly, the rapid advancement of technology in the semiconductor industry necessitates the adoption of more efficient handling systems to manage increasingly complex chips. Secondly, the surge in consumer electronics, such as smartphones, tablets, and wearables, has led to higher production volumes of memory and logic chips, necessitating robust handling solutions. Additionally, the automotive industry's transition towards electrification and the integration of advanced driver-assistance systems (ADAS) are creating new demands for semiconductor components, thereby fueling the need for effective chip handling. The growing focus on automation in manufacturing processes is another significant growth factor, as it enhances production efficiency and reduces labor costs. Finally, innovations in packaging technologies, including 3D packaging and flip-chip technologies, are further driving the demand for semiconductor chip handlers that can accommodate these advancements.

Key Highlights of the Market

• The semiconductor chip handler market is expected to grow at a CAGR of 6.8% from 2025 to 2035.
• Increasing demand for consumer electronics is driving the need for efficient chip handling solutions.
• Emergence of 5G technology is boosting investments in semiconductor manufacturing.
• The automotive sector's transition towards electric vehicles is creating new opportunities for chip handlers.
• Automation and advanced packaging technologies are key growth factors in the industry.

By Product Type

Pick-and-Place Chip Handler:

Pick-and-place chip handlers are designed to efficiently transfer semiconductor chips from their manufacturing location to packaging or testing stations. These handlers utilize robotic arms to 'pick' chips from a tray or conveyor belt and 'place' them onto a carrier or substrate with high accuracy. The demand for pick-and-place chip handlers is on the rise due to their ability to enhance production speed and reduce the risk of damage during handling. Additionally, advances in robotic technology and vision systems have allowed these handlers to achieve greater precision and adaptability, making them suitable for a wide range of chip sizes and types. This flexibility is particularly valuable in high-volume production environments where various semiconductor products must be processed simultaneously. The growing trend toward automation in semiconductor manufacturing further supports the adoption of pick-and-place systems, as companies seek to improve operational efficiency and reduce labor costs.

Gravity Feed Chip Handler:

Gravity feed chip handlers utilize the force of gravity to move semiconductor chips into position for handling and packaging. These systems are often used for high-volume production environments where chips are fed into the handler from a bulk supply source. The simplicity and reliability of gravity feed systems make them an attractive option for manufacturers looking to streamline their operations. These chip handlers are known for their minimal moving parts, which reduces maintenance needs and operational downtime. As semiconductor manufacturers strive to increase throughput while maintaining high-quality standards, gravity feed handlers provide a cost-effective solution to meet these demands. Additionally, technology advancements in materials and design are enhancing the performance of gravity feed systems, making them suitable for a wider range of chip types, including those used in consumer electronics and automotive applications.

Pick-and-Place & Gravity Feed Chip Handler:

The combination of pick-and-place and gravity feed functionalities into a single chip handling system offers manufacturers a versatile solution for semiconductor production. These hybrid systems allow for the efficient processing of chips from bulk supply and the precise placement of chips onto carriers or substrates. By integrating the strengths of both handling types, manufacturers can optimize workflows, reduce handling errors, and improve overall productivity. The demand for these hybrid chip handlers is growing as manufacturers face the need to adapt quickly to changing production requirements and increased product complexity. With the ongoing advancements in automation and robotics, hybrid chip handlers are becoming increasingly sophisticated, capable of handling a diverse array of semiconductor products while ensuring high throughput and accuracy.

Test-in-Strip Chip Handler:

Test-in-strip chip handlers enable the testing of semiconductor chips while they are still attached to their manufacturing strips, rather than removing them for individual testing. This method not only saves time and reduces costs associated with handling and packaging but also allows for a more efficient quality assurance process. The test-in-strip approach has gained traction in the semiconductor industry due to its ability to improve production throughput and reduce the risk of damage to chips during handling. As the demand for high-performance chips continues to rise, the need for effective testing solutions is critical. Test-in-strip chip handlers are particularly valuable in sectors such as telecommunications and computing, where rigorous testing standards must be met to ensure product reliability and performance. Innovations in testing technologies and integration into handling systems are expected to drive further adoption of test-in-strip chip handlers in the coming years.

Test-in-Tray Chip Handler:

Test-in-tray chip handlers are designed to facilitate the testing of semiconductor chips while they are held in trays, allowing for efficient handling and integration into automated testing processes. These systems are essential for maintaining high throughput in semiconductor manufacturing, as they streamline the testing process by minimizing the handling steps required. The growing complexity of semiconductor devices, combined with the demand for higher performance and reliability, has spurred the development of test-in-tray chip handlers that can accommodate a wide range of chip sizes and configurations. As manufacturers continue to push the boundaries of chip technology, the need for effective testing solutions that ensure quality control is paramount. The adoption of test-in-tray chip handlers is expected to rise, driven by advancements in automation and the increasing focus on reducing production costs while maintaining high-quality standards.

By Application

Memory Chips:

Memory chips are a significant application area for semiconductor chip handlers, as they are integral components in various electronic devices, including computers, smartphones, and servers. The demand for memory chips has surged, fueled by the exponential growth in data generation and the increasing need for efficient data storage solutions. Chip handlers designed for memory chips must be capable of handling large volumes with high precision to prevent damage and ensure quality. Manufacturers are investing in advanced handling systems that can accommodate the specific requirements of memory chip production, including stringent quality control measures. As the memory chip market continues to expand, particularly with the rise of cloud computing and big data analytics, the need for effective handling solutions will remain strong, driving innovation in chip handler technologies tailored for this application.

Logic Chips:

Logic chips, which are crucial for processing tasks in electronic devices, represent another significant segment within the semiconductor chip handler market. These chips are used in a wide range of applications, from consumer electronics to industrial automation. The increasing complexity of logic chips, driven by advancements in technology such as artificial intelligence and machine learning, necessitates sophisticated handling solutions that can accommodate their varying sizes and configurations. Chip handlers for logic chips must provide precision and reliability to ensure optimal performance and minimize defects during production. As the demand for high-performance logic chips continues to rise, manufacturers are increasingly focusing on upgrading their handling systems to boost efficiency and maintain quality standards, further propelling the growth of this segment within the semiconductor chip handler market.

Analog Chips:

Analog chips, essential for processing real-world signals in applications such as audio, video, and telecommunications, are a crucial sector in the semiconductor market. The growing need for devices that can interface with the physical world, particularly in the context of the Internet of Things (IoT) and smart technologies, is driving demand for analog chips. Chip handlers designed specifically for analog devices must ensure that these sensitive components are handled with care to prevent damage and maintain signal integrity. As industries strive to integrate more analog functionalities within digital systems, the market for analog chip handlers is expected to expand, leading manufacturers to invest in innovative handling technologies that cater to the unique requirements of analog chip production.

Microprocessor Chips:

Microprocessor chips are at the heart of modern computing and play a pivotal role in various industries, from consumer electronics to industrial applications. The increasing demand for high-performance computing solutions, particularly with the advent of cloud computing and data centers, has led to a surge in the production of microprocessors. Chip handlers for microprocessor chips must be capable of handling complex designs and ensuring that chips are processed with high precision and efficiency. As manufacturers aim to enhance processor capabilities while minimizing costs, the need for reliable and effective handling solutions is paramount. The growing focus on energy efficiency and performance optimization in microprocessor design is expected to further drive advancements in handling technologies tailored to meet the requirements of this critical segment of the semiconductor market.

By Distribution Channel

Direct Sales:

Direct sales remain a significant distribution channel within the semiconductor chip handler market, allowing manufacturers to engage directly with customers and tailor solutions to their specific needs. This approach facilitates better communication between manufacturers and clients, enabling a deeper understanding of customer requirements and preferences. By offering direct sales, manufacturers can provide more personalized service, including technical support and customization options, which are particularly valuable in industries with unique handling challenges. The direct sales model also allows for quicker response times and flexibility in addressing market demands, which is crucial in the fast-paced semiconductor industry. As manufacturers continue to seek ways to optimize their operations and enhance customer relationships, the direct sales channel is likely to remain a key component of their distribution strategies.

Distributor:

Distributors play a vital role in the semiconductor chip handler market by providing a broader reach to manufacturers and facilitating access to a diverse customer base. Through established networks and relationships, distributors can effectively promote and sell chip handling solutions across various industries, ensuring that manufacturers can penetrate markets that may be difficult to access directly. Distributors often provide additional value-added services, such as inventory management and technical support, which can enhance the overall customer experience. The growing trend towards outsourcing distribution functions is leading manufacturers to increasingly rely on distributors to streamline their operations and focus on core competencies. As the semiconductor industry continues to evolve, the role of distributors in connecting manufacturers with end-users is expected to grow, driving further adoption of chip handling technologies.

By Material Type

Metal:

Metal is a primary material type used in the construction of chip handling systems, offering durability and strength essential for the efficient movement and processing of semiconductor chips. The use of metals, such as aluminum and stainless steel, provides the necessary structural integrity to withstand the rigors of semiconductor manufacturing environments. Metal chip handlers are designed to be robust and capable of handling a variety of chip sizes while maintaining precision and reliability. The thermal and electrical conductivity of metal materials also plays a crucial role in ensuring the performance of chip handlers, especially in high-speed applications. As manufacturers continue to demand higher performance and durability from their handling systems, the use of metal materials is expected to remain predominant in the semiconductor chip handler market, driving innovation in design and functionality.

Plastic:

Plastic materials are increasingly being utilized in semiconductor chip handling systems due to their lightweight properties and versatility. The use of plastics allows for the design of handlers that can be easily customized to meet specific requirements, such as varying chip sizes and configurations. Moreover, plastic materials can be engineered to provide excellent insulation properties, which is vital in preventing electrostatic discharge (ESD) that can damage sensitive semiconductor components. The growing trend towards miniaturization in electronic devices is also driving the demand for plastic chip handlers, as they can facilitate more compact designs without compromising performance. Additionally, advancements in manufacturing processes and material science are leading to the development of high-performance plastics capable of withstanding the demands of semiconductor production environments. As these trends continue, the use of plastic materials in chip handling systems is expected to increase significantly.

Composite:

Composite materials combine the advantageous properties of both metals and plastics, enabling the development of chip handling systems that are lightweight yet strong and durable. The use of composites in semiconductor chip handlers offers enhanced performance characteristics, such as improved resistance to wear and tear, making them suitable for demanding production environments. These materials can be engineered to possess specific properties, such as increased thermal resistance and reduced ESD susceptibility, which are particularly valuable in semiconductor manufacturing. As the industry evolves and manufacturers seek to optimize performance while reducing costs, the adoption of composite materials in chip handling systems is likely to increase. The continuous innovation in composite technology is expected to drive the development of advanced chip handlers that cater to the changing needs of the semiconductor market.

By Region

The North American semiconductor chip handler market is one of the largest globally, driven by the presence of major technology companies and a robust manufacturing ecosystem. In this region, the market is projected to grow at a CAGR of 7.2% from 2025 to 2035, fueled by increasing investments in automation and advanced manufacturing technologies. The United States, in particular, is a hub for semiconductor innovation, with numerous research and development facilities focused on enhancing chip handling and packaging solutions. Additionally, the rising demand for high-performance semiconductor devices across various sectors, including telecommunications and automotive, is further propelling market growth in North America. The ongoing advancements in 5G technology and IoT applications are expected to continue to drive the demand for effective handling solutions in the region.

In Europe, the semiconductor chip handler market is also experiencing significant growth, supported by the increasing focus on electronics manufacturing and the push towards digital transformation across industries. The European market is projected to expand at a CAGR of 6.5% during the forecast period, driven by the rising demand for semiconductor devices in sectors such as industrial automation, healthcare, and automotive. The region's strategic initiatives to enhance semiconductor production capabilities and invest in research and development are expected to facilitate the adoption of advanced chip handling technologies. Furthermore, the growing emphasis on sustainability and energy efficiency in manufacturing processes is leading to innovations in chip handler designs that align with these objectives, contributing to the overall growth of the market in Europe.

Opportunities

The semiconductor chip handler market presents numerous opportunities for growth, particularly in the context of evolving technology and industry demands. One significant opportunity lies in the increasing adoption of automation across semiconductor manufacturing processes. As manufacturers strive for enhanced efficiency and reduced operational costs, the integration of automated chip handling systems is becoming a necessity. Companies that focus on developing innovative, automated solutions with advanced features such as artificial intelligence and machine learning capabilities will likely find a strong market presence. Furthermore, there is an opportunity to cater to the growing demand for high-performance semiconductor devices in emerging sectors, such as electric vehicles and renewable energy technologies. By aligning product offerings with these emerging trends, manufacturers can position themselves favorably in the semiconductor chip handler market.

Another opportunity stems from the increasing focus on research and development in advanced packaging technologies, such as 3D integration and system-in-package (SiP) solutions. The development of sophisticated semiconductor devices that require novel handling solutions is driving demand for innovative chip handlers capable of accommodating these advancements. Companies that invest in R&D to create next-generation chip handling technologies that support advanced packaging methods will be well-positioned to capture market share. Additionally, expanding into emerging markets, particularly in Asia Pacific and Latin America, offers significant growth potential. As these regions continue to expand their semiconductor manufacturing capabilities, the demand for effective chip handling solutions is expected to rise, providing opportunities for manufacturers to establish a presence and capitalize on growing markets.

Threats

Despite the promising growth prospects in the semiconductor chip handler market, several threats could hinder its expansion. One major threat is the increasing competition among manufacturers, leading to price wars and reduced profit margins. As new players enter the market, established companies may find it challenging to maintain their market share and pricing power, especially if they do not continually innovate and adapt to industry changes. Moreover, the rapid pace of technological advancements means that manufacturers must invest significantly in research and development to keep up with emerging trends and customer demands. Failure to innovate could result in outdated products and loss of market relevance, further exacerbating the competitive pressure faced by companies in the sector. Additionally, fluctuations in global supply chains, particularly in light of geopolitical tensions and economic uncertainties, could disrupt the availability of critical materials and components needed for chip handling systems.

Another significant restraining factor is the stringent regulatory environment surrounding semiconductor manufacturing and handling processes. As governments impose stricter regulations regarding environmental sustainability, safety standards, and product quality, manufacturers may face increased compliance costs and operational challenges. Adapting to these regulations may require significant investments in upgrading facilities and technologies to meet new standards, which could strain financial resources. Furthermore, the semiconductor industry is highly susceptible to supply chain disruptions, as seen during the COVID-19 pandemic, which highlighted vulnerabilities in global production networks. Any future disruptions could adversely affect the semiconductor chip handler market and hinder growth potential as companies struggle to secure necessary components and materials for manufacturing.

Competitor Outlook

• ASM Pacific Technology Ltd.
• K&S (Kulicke and Soffa Industries, Inc.)
• Seiko Epson Corporation
• Mitsubishi Electric Corporation
• Advanced Semiconductor Engineering, Inc. (ASE Group)
• Teradyne Inc.
• Tokyo Electron Limited (TEL)
• Palomar Technologies, Inc.
• Hesse Mechatronics GmbH
• Suss MicroTec AG
• Hughes Microtech
• Accu-Trim Technology
• F&K Delvotec Bondtechnologie GmbH
• Vision Engineering Ltd.
• Exceed Technologies, Inc.

The competitive landscape of the semiconductor chip handler market is characterized by a diverse array of companies, ranging from established global leaders to emerging players specializing in niche technologies. Key competitors are focusing on innovation and R&D to enhance their product offerings and maintain a competitive edge in the market. For instance, companies like ASM Pacific Technology and K&S are investing heavily in automation and advanced handling technologies to streamline manufacturing processes and improve efficiency. Additionally, the growing trend towards miniaturization in semiconductor devices is prompting competitors to develop handling systems that can accommodate smaller and more complex chips while ensuring precision and reliability. Collaboration and partnerships among key players are also becoming more common as companies seek to leverage complementary technologies and expertise to enhance their product portfolios.

Major companies such as Teradyne and Advanced Semiconductor Engineering are also focusing on strategies to expand their presence in emerging markets, particularly in Asia-Pacific and Latin America. These regions are witnessing significant growth in semiconductor manufacturing, driven by rising consumer demand for electronics and advancements in technology. By establishing local partnerships and enhancing distribution networks, these companies aim to capitalize on the growing market opportunities in these areas. Furthermore, sustainability is becoming a key focus for many firms, leading them to develop eco-friendly chip handling solutions that align with global environmental standards. As the semiconductor industry continues to evolve, the ability to adapt to customer needs, embrace technological advancements, and maintain operational excellence will be crucial for companies to thrive in the competitive semiconductor chip handler market.

Firms such as Seiko Epson Corporation and Mitsubishi Electric Corporation are also making strides in the semiconductor chip handler market by leveraging their extensive experience in automation and robotics to create innovative handling solutions. These companies are known for their commitment to quality and reliability, which positions them favorably as customer preferences shift towards more advanced and efficient handling technologies. The emphasis on reducing production costs while increasing throughput is driving these companies to invest in cutting-edge technologies, such as artificial intelligence and machine learning, to optimize their chip handling operations. As the demand for high-performance semiconductor devices continues to grow, these companies are well-positioned to meet the evolving needs of the market through continuous innovation and a strong focus on customer satisfaction.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 Teradyne Inc.
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Hughes Microtech
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 Suss MicroTec AG
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Accu-Trim Technology
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 Hesse Mechatronics GmbH
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Seiko Epson Corporation
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 Vision Engineering Ltd.
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Exceed Technologies, Inc.
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 Palomar Technologies, Inc.
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 ASM Pacific Technology Ltd.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Tokyo Electron Limited (TEL)
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Mitsubishi Electric Corporation
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 F&K Delvotec Bondtechnologie GmbH
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 K&S (Kulicke and Soffa Industries, Inc.)
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Advanced Semiconductor Engineering, Inc. (ASE Group)
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 Chip Handler in Semiconductor Market, By Application
    • 6.1.1 Memory Chips
    • 6.1.2 Logic Chips
    • 6.1.3 Analog Chips
    • 6.1.4 Microprocessor Chips
    • 6.1.5 Others
  • 6.2 Chip Handler in Semiconductor Market, By Product Type
    • 6.2.1 Pick-and-Place Chip Handler
    • 6.2.2 Gravity Feed Chip Handler
    • 6.2.3 Pick-and-Place & Gravity Feed Chip Handler
    • 6.2.4 Test-in-Strip Chip Handler
    • 6.2.5 Test-in-Tray Chip Handler
  • 6.3 Chip Handler in Semiconductor Market, By Material Type
    • 6.3.1 Metal
    • 6.3.2 Plastic
    • 6.3.3 Composite
  • 6.4 Chip Handler in Semiconductor Market, By Distribution Channel
    • 6.4.1 Direct Sales
    • 6.4.2 Distributor

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Middle East & Africa - Market Analysis
    • 10.5.1 By Country
      • 10.5.1.1 Middle East
      • 10.5.1.2 Africa
  • 10.6 Chip Handler in Semiconductor Market by Region

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global Chip Handler in Semiconductor market is categorized based on

By Product Type

• Pick-and-Place Chip Handler
• Gravity Feed Chip Handler
• Pick-and-Place & Gravity Feed Chip Handler
• Test-in-Strip Chip Handler
• Test-in-Tray Chip Handler

By Application

• Memory Chips
• Logic Chips
• Analog Chips
• Microprocessor Chips
• Others

By Distribution Channel

• Direct Sales
• Distributor

By Material Type

• Metal
• Plastic
• Composite

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• ASM Pacific Technology Ltd.
• K&S (Kulicke and Soffa Industries, Inc.)
• Seiko Epson Corporation
• Mitsubishi Electric Corporation
• Advanced Semiconductor Engineering, Inc. (ASE Group)
• Teradyne Inc.
• Tokyo Electron Limited (TEL)
• Palomar Technologies, Inc.
• Hesse Mechatronics GmbH
• Suss MicroTec AG
• Hughes Microtech
• Accu-Trim Technology
• F&K Delvotec Bondtechnologie GmbH
• Vision Engineering Ltd.
• Exceed Technologies, Inc.