Ball Grid Array (BGA) Packaging

Ball Grid Array (BGA) Packaging Market Outlook

The global Ball Grid Array (BGA) packaging market is projected to reach USD 5.23 billion by 2035, growing at a compound annual growth rate (CAGR) of 6.9% from 2025. The demand for high-performance packaging solutions in the rapidly evolving electronics sector, driven by the increasing complexity of integrated circuits and the miniaturization of devices, plays a significant role in this growth. Additionally, innovations in BGA technology, including the development of advanced materials and manufacturing processes, are expected to enhance performance and reliability, thus attracting more manufacturers to adopt BGA solutions in their products. Furthermore, the expanding applications in various sectors, such as consumer electronics, automotive, and aerospace, contribute to the market's robust growth trajectory. The global push for electrification in vehicles and advancements in medical device technology further underscore the importance of BGA packaging solutions in addressing modern electronic design challenges.

Growth Factor of the Market

Several factors are propelling the growth of the BGA packaging market. The increasing demand for compact and lightweight electronics, particularly in consumer electronics and portable devices, is driving manufacturers to adopt BGA technology due to its efficient space utilization. Furthermore, as technology evolves, the push for enhanced thermal performance and electrical efficiency in devices is leading to the adoption of BGA packages, which provide superior heat dissipation capabilities compared to traditional packaging methods. Additionally, the booming automotive sector, particularly with the rise of electric vehicles (EVs), is creating opportunities for BGA applications in power electronics, sensor technologies, and advanced driver-assistance systems (ADAS). The aerospace and medical device sectors are also showing a growing inclination towards BGA packaging as it offers high reliability and performance in demanding environments. Finally, the emergence of new markets and the growing emphasis on research and development for innovative packaging solutions are expected to foster significant growth in the coming years.

Key Highlights of the Market

• The market is projected to reach USD 5.23 billion by 2035, growing at a CAGR of 6.9%.
• Consumer electronics and automotive applications are the largest contributors to the market growth.
• Technological advancements in BGA materials and manufacturing processes enhance product reliability and performance.
• Emergence of electric vehicles and advancements in medical devices are key growth drivers.
• Asia Pacific is expected to remain the largest regional market for BGA packaging solutions.

By Product Type

PBGA:

Plastic Ball Grid Array (PBGA) packaging has become a popular choice among manufacturers due to its lightweight and cost-effective characteristics. PBGA packages are primarily used in consumer electronics, where space constraints are a high priority. These packages offer a significant reduction in footprint compared to traditional packaging methods, allowing for greater design flexibility in compact devices. Additionally, PBGA packages are well-suited for high-performance applications, owing to their excellent thermal and electrical properties. The increasing demand for consumer electronics, such as smartphones and tablets, has led to an uptick in the adoption of PBGA solutions, ensuring their position as a crucial segment within the BGA packaging market.

TBGA:

Thin Ball Grid Array (TBGA) packages are designed to deliver superior electrical performance and heat dissipation in a compact form factor. They are particularly favored in high-density applications, including memory chips and high-performance processors. The thin profile of TBGA facilitates better integration into smaller electronic devices, making them a preferred choice in the rapidly evolving consumer electronics market. Moreover, advancements in TBGA manufacturing processes have further enhanced their reliability and performance, driving their adoption across various applications, including automotive and industrial sectors. The trend toward miniaturization and increased functionality in electronics is likely to bolster the demand for TBGA packaging in the coming years.

CBGA:

Ceramic Ball Grid Array (CBGA) packaging is known for its robustness and durability, making it ideal for applications requiring high reliability in extreme environments, such as aerospace and military systems. CBGA packages provide excellent thermal performance and mechanical stability, which are essential in applications that experience significant temperature fluctuations. While they may be more expensive than plastic alternatives, their performance benefits justify the investment for critical applications. The growing focus on advanced technology in aerospace, along with increasing research and development activities in high-reliability electronics, is expected to drive the demand for CBGA packages in specialized applications.

LBGA:

Low-Profile Ball Grid Array (LBGA) packages are specifically designed to meet the needs of high-density applications while minimizing height, allowing for slimmer electronic device designs. These packages are particularly popular in mobile applications, where space is at a premium. LBGA solutions are increasingly being adopted in consumer electronics, telecommunications, and computing devices due to their ability to maintain performance standards while offering a reduced profile. The surge in demand for compact electronic devices is expected to propel the growth of LBGA packaging solutions, as manufacturers continue to innovate and meet consumer expectations for slimmer and lighter products.

EBGA:

Embedded Ball Grid Array (EBGA) packaging is gaining traction as manufacturers seek solutions that integrate chip functionality with packaging. This innovative approach allows for higher levels of integration, resulting in reduced package size and improved performance. EBGA technology is particularly suitable for applications in mobile and portable devices, where both performance and space optimization are critical. The increasing trend towards multi-functionality in electronics further supports the growth of EBGA solutions, as they enable manufacturers to consolidate features and improve device efficiency. The continuous evolution of electronic devices and the growing demand for advanced packaging solutions are expected to boost the adoption of EBGA in various sectors.

By Application

Consumer Electronics:

The consumer electronics sector remains the largest application area for BGA packaging, driven by the ever-increasing demand for compact, high-performance devices such as smartphones, tablets, and laptops. With advancements in technology, manufacturers are required to produce devices that are lighter and slimmer while maintaining or enhancing functionality. BGA packaging, particularly PBGA and TBGA, offers the critical space-saving and thermal performance characteristics needed to meet these evolving demands. The continuous innovation in consumer electronics, particularly with the integration of artificial intelligence and IoT features, is expected to further spur growth in this sector, increasing the reliance on sophisticated BGA solutions.

Automotive:

The automotive industry is experiencing a significant transformation, especially with the rise of electric and autonomous vehicles. BGA packaging is integral to this evolution, as it supports the complex electronic systems required for modern vehicles, including advanced driver-assistance systems (ADAS) and infotainment units. The demand for high-performance, reliable packaging solutions that can withstand extreme conditions is driving the adoption of BGA technology in automotive applications. As automakers prioritize safety, efficiency, and connectivity, the incorporation of BGA packaging is likely to grow, providing suppliers with ample opportunities to expand their market presence within this dynamic sector.

Aerospace:

The aerospace sector demands the highest reliability in electronic components due to the critical nature of its applications. BGA packaging, particularly CBGA, is favored for its robustness and ability to handle environmental extremes encountered in aerospace operations. As the demand for advanced avionics, satellite technology, and drone systems increases, the need for dependable electronic packaging solutions becomes essential. The ongoing advancements in aerospace technology, including initiatives aimed at reducing weight and enhancing performance, are expected to bolster the adoption of BGA packaging, providing manufacturers with growth opportunities in this high-stakes market.

Medical Devices:

The medical device industry is another key application area for BGA packaging, where reliability, accuracy, and compactness are of utmost importance. The growing complexity of medical electronics, including diagnostic equipment and wearable health monitors, necessitates advanced packaging solutions that can deliver high performance in confined spaces. BGA packaging, including both LBGA and PBGA, is increasingly being utilized for its thermal performance and reliability, essential for critical medical applications. As the healthcare sector continues to prioritize innovation and efficiency, the demand for sophisticated BGA solutions in medical devices is expected to rise significantly over the coming years.

Industrial:

BGA packaging is also making inroads into industrial applications, where robust and reliable electronics are required for automation, control systems, and instrumentation. Industries are increasingly integrating smart technologies and IoT devices, driving the need for packaging solutions that can withstand challenging operational environments. The versatility of BGA packaging, combined with its capability to support advanced performance requirements, positions it as a suitable option for industrial applications. As industries continue to embrace digital transformation, the adoption of BGA technology is likely to expand, offering significant growth potential for manufacturers in the sector.

By Distribution Channel

Direct Sales:

Direct sales channels have been a crucial component of the BGA packaging market, enabling manufacturers to establish close relationships with customers and gain insights into their specific needs. By engaging directly with end-users, companies can provide tailored solutions that meet the unique requirements of various applications. Direct sales also allow for more streamlined communication and support, which is particularly important in sectors such as aerospace and medical devices, where reliability and precision are paramount. As the market continues to evolve, the direct sales channel is likely to remain a key driver of growth, facilitating the exchange of valuable feedback and fostering long-term partnerships.

Distributors:

Distributors play a vital role in the BGA packaging market by providing manufacturers with extensive reach and access to a broader customer base. They often have established networks and relationships that can help facilitate quicker and more efficient sales processes. Distributors also offer valuable support services, including inventory management and logistics, which can be critical for manufacturers looking to streamline operations. As the demand for BGA solutions continues to rise across various sectors, the role of distributors in ensuring timely delivery and availability of products will become increasingly important, allowing manufacturers to focus on innovation and product development.

Online Retail:

The rise of e-commerce has transformed how BGA packaging solutions are marketed and sold. Online retail platforms provide manufacturers with a cost-effective avenue to reach global markets, enabling them to showcase their products to a diverse range of customers. Online channels offer convenient access to information, allowing potential buyers to compare products, read reviews, and make informed purchasing decisions. Moreover, the ability to leverage digital marketing strategies can significantly enhance brand visibility and customer engagement. As the trend towards online shopping continues to grow, the online retail channel is poised to become increasingly important for the BGA packaging market, offering new opportunities for expansion and growth.

By Material Type

Ceramic BGA:

Ceramic Ball Grid Array (CBGA) packaging is favored for its superior thermal and mechanical properties, making it ideal for high-reliability applications in aerospace, military, and medical devices. The robust structure of ceramic packages ensures high performance in extreme environments, where reliability is non-negotiable. While the manufacturing process for ceramic BGAs may be more complex and costly than that of plastic alternatives, the long-term benefits in terms of durability and heat resistance justify the investment. The demand for advanced technology in critical applications is driving the growth of ceramic BGA packaging solutions, as manufacturers prioritize quality and reliability in their designs.

Organic BGA:

Organic Ball Grid Array (OBGA) packaging has gained traction due to its lightweight and cost-effective nature. It offers excellent electrical performance and is easier to process compared to ceramic options, making it suitable for a wide range of applications, particularly in consumer electronics. The organic materials used in OBGA provide good thermal performance while allowing for more complex designs. As consumer electronics evolve and the demand for high-performance, compact devices increases, organic BGA solutions are likely to see significant growth, driven by innovations in material technology and manufacturing processes.

Metal BGA:

Metal Ball Grid Array (MBGA) packaging is known for its exceptional durability and reliability, making it ideal for applications requiring high mechanical strength. The metal substrates provide excellent thermal conductivity, making MBGA suitable for high-power applications in sectors such as automotive and industrial. While the cost of metal BGAs may be higher than that of plastic or organic alternatives, their performance advantages in demanding environments justify the investment. The growing trend towards electrification in vehicles and the demand for high-performance electronics are expected to drive the adoption of MBGA packaging solutions in the foreseeable future.

Glass BGA:

Glass Ball Grid Array (GBGA) packaging has emerged as a novel solution due to its excellent electrical insulating properties and thermal stability. These packages are particularly suitable for high-frequency applications, making them an attractive option for telecommunications and advanced computing devices. The use of glass as a substrate can offer improved reliability in harsh environments, further enhancing the appeal of GBGA solutions in critical applications. As the demand for high-performance electronics continues to rise, the adoption of glass BGA packaging is expected to expand, driven by innovations in material science and increased focus on reliability.

Silicon BGA:

Silicon Ball Grid Array (SBGA) packaging represents a significant leap in packaging technology, allowing for enhanced integration of chip functionalities within the package itself. This innovative approach not only reduces the overall size of the package but also improves performance by minimizing signal delay and enhancing thermal management. SBGA solutions are particularly suited for applications in high-density electronics, such as smartphones and wearables, where both performance and miniaturization are critical. The continuous evolution of semiconductor technology and growing demand for advanced packaging solutions are expected to drive the adoption of silicon BGA packaging in various sectors.

By Region

The North American BGA packaging market is expected to hold a significant share, primarily due to the region's advanced technological landscape and the presence of leading electronics manufacturers. The rapid growth of sectors such as automotive, healthcare, and aerospace is driving the demand for high-performance BGA packaging solutions. The North American market is projected to witness a CAGR of 7.5% over the forecast period, as manufacturers continue to innovate and develop advanced packaging technologies that meet the evolving needs of various applications. The strong focus on research and development in this region further supports its position as a key player in the global BGA packaging market.

In Europe, the BGA packaging market is also expected to show robust growth, driven by increasing demand from sectors such as automotive and consumer electronics. The region's emphasis on technological advancements, coupled with the growing adoption of electric vehicles and smart devices, is boosting the need for efficient and reliable packaging solutions. The European market is anticipated to grow at a CAGR of 6.0%, as manufacturers strive to meet the requirements of high-performance applications while addressing environmental sustainability concerns. The strong presence of established electronics firms and a favorable regulatory environment further contribute to the growth of the BGA packaging market in Europe.

Opportunities

As the electronics industry continues to advance, the BGA packaging market is presented with substantial growth opportunities. One of the most significant opportunities lies in the increasing demand for electric vehicles (EVs), which require sophisticated electronic systems that rely on high-performance packaging solutions. As automotive manufacturers shift their focus towards electrification, the need for reliable and efficient BGA packaging will grow, enabling manufacturers to capitalize on this emerging trend. Furthermore, the expansion of the Internet of Things (IoT) and smart device ecosystems presents additional opportunities for BGA solutions, as the proliferation of connected devices necessitates compact and efficient packaging technologies. These trends not only highlight the potential for growth but also encourage innovation in packaging design and materials, positioning BGA manufacturers favorably in the competitive landscape.

Another area of opportunity for the BGA packaging market is the increasing emphasis on sustainability and environmentally friendly practices. As manufacturers seek to reduce their environmental footprint, there is a growing interest in developing eco-friendly packaging solutions that minimize waste and energy consumption during production. This shift towards sustainability is prompting companies to explore innovative materials and manufacturing processes that align with environmental goals, creating new market opportunities. Additionally, the growing regulatory focus on environmental standards and the demand for sustainable products provide strong incentives for manufacturers to invest in research and development for greener BGA packaging solutions. By aligning their strategies with these trends, BGA manufacturers can position themselves as leaders in the evolving marketplace.

Threats

Despite the numerous opportunities within the BGA packaging market, several threats could hinder growth. One significant threat is the increasing competition from alternative packaging technologies, such as Flip Chip and 3D packaging solutions, which may offer advantages in specific applications. As manufacturers seek to adopt advanced packaging technologies that provide superior performance and lower costs, the demand for traditional BGA solutions could be negatively impacted. Additionally, fluctuations in raw material prices may pose challenges for manufacturers, as rising costs could erode profit margins and make it difficult to offer competitive pricing. Furthermore, the global semiconductor supply chain disruptions experienced in recent years highlight the vulnerability of the electronics sector, which could affect the availability and delivery of BGA packaging solutions to end-users.

Another potential restrainer for the BGA packaging market is the regulatory landscape, which is becoming increasingly stringent regarding environmental and safety standards. Manufacturers may face challenges in ensuring compliance with these regulations, especially in regions with strict guidelines. Meeting these standards may require investments in new technologies and processes, resulting in increased operational costs. Moreover, rapid technological advancements necessitate continuous adaptation, which can strain resources for manufacturers. Companies must remain vigilant and responsive to these changes in the regulatory environment to mitigate potential risks and ensure sustained growth in the BGA packaging market.

Competitor Outlook

• Amkor Technology, Inc.
• ASE Group
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Texas Instruments Incorporated
• STMicroelectronics N.V.
• Infineon Technologies AG
• ON Semiconductor Corporation
• Microchip Technology Inc.
• Intel Corporation
• Rohm Semiconductor
• Broadcom Inc.
• Toshiba Corporation
• NEC Corporation
• GlobalFoundries Inc.
• NXP Semiconductors N.V.

The BGA packaging market is characterized by a competitive landscape with several prominent players vying for market share. Companies in this space are increasingly focusing on technological advancements, product innovation, and strategic partnerships to enhance their competitive positioning. Key players such as Amkor Technology and ASE Group are leveraging their extensive manufacturing capabilities and experience to provide high-quality packaging solutions that meet diverse customer needs. The constant drive for innovation in packaging materials and manufacturing processes fuels competition, compelling companies to invest heavily in research and development. Moreover, as the demand for advanced packaging solutions continues to rise, companies are increasingly collaborating with semiconductor manufacturers to align their offerings with emerging trends and technologies.

Amkor Technology, Inc. is one of the leading players in the BGA packaging market, known for its comprehensive portfolio of packaging solutions, including BGA, PBGA, and TBGA technologies. The company has established a strong global presence and operates multiple manufacturing facilities to support diverse customer requirements. By focusing on innovation and sustainability, Amkor continuously enhances its product offerings, ensuring they remain at the forefront of the industry. Additionally, their commitment to quality and customer service has earned them a reliable reputation among clients across various sectors, positioning them favorably in the competitive landscape.

ASE Group is another significant player in the BGA packaging market, offering a wide range of advanced packaging solutions aimed at meeting the growing demands of the electronics industry. With a strong emphasis on research and development, ASE invests heavily in advanced technologies to enhance performance and reliability. The company's diverse product portfolio includes PBGA, CBGA, and LBGA solutions, catering to various applications, such as consumer electronics, automotive, and industrial sectors. By continuously expanding its manufacturing capabilities and exploring new materials, ASE Group demonstrates a commitment to innovation that positions it as a key player in the evolving BGA packaging market.

• 1 Appendix

  • 1.1 List of Tables
  • 1.2 List of Figures

• 2 Introduction

  • 2.1 Market Definition
  • 2.2 Scope of the Report
  • 2.3 Study Assumptions
  • 2.4 Base Currency & Forecast Periods

• 3 Market Dynamics

  • 3.1 Market Growth Factors
  • 3.2 Economic & Global Events
  • 3.3 Innovation Trends
  • 3.4 Supply Chain Analysis

• 4 Consumer Behavior

  • 4.1 Market Trends
  • 4.2 Pricing Analysis
  • 4.3 Buyer Insights

• 5 Key Player Profiles

  • 5.1 ASE Group
    • 5.1.1 Business Overview
    • 5.1.2 Products & Services
    • 5.1.3 Financials
    • 5.1.4 Recent Developments
    • 5.1.5 SWOT Analysis
  • 5.2 Broadcom Inc.
    • 5.2.1 Business Overview
    • 5.2.2 Products & Services
    • 5.2.3 Financials
    • 5.2.4 Recent Developments
    • 5.2.5 SWOT Analysis
  • 5.3 NEC Corporation
    • 5.3.1 Business Overview
    • 5.3.2 Products & Services
    • 5.3.3 Financials
    • 5.3.4 Recent Developments
    • 5.3.5 SWOT Analysis
  • 5.4 Intel Corporation
    • 5.4.1 Business Overview
    • 5.4.2 Products & Services
    • 5.4.3 Financials
    • 5.4.4 Recent Developments
    • 5.4.5 SWOT Analysis
  • 5.5 Rohm Semiconductor
    • 5.5.1 Business Overview
    • 5.5.2 Products & Services
    • 5.5.3 Financials
    • 5.5.4 Recent Developments
    • 5.5.5 SWOT Analysis
  • 5.6 Toshiba Corporation
    • 5.6.1 Business Overview
    • 5.6.2 Products & Services
    • 5.6.3 Financials
    • 5.6.4 Recent Developments
    • 5.6.5 SWOT Analysis
  • 5.7 GlobalFoundries Inc.
    • 5.7.1 Business Overview
    • 5.7.2 Products & Services
    • 5.7.3 Financials
    • 5.7.4 Recent Developments
    • 5.7.5 SWOT Analysis
  • 5.8 Amkor Technology, Inc.
    • 5.8.1 Business Overview
    • 5.8.2 Products & Services
    • 5.8.3 Financials
    • 5.8.4 Recent Developments
    • 5.8.5 SWOT Analysis
  • 5.9 NXP Semiconductors N.V.
    • 5.9.1 Business Overview
    • 5.9.2 Products & Services
    • 5.9.3 Financials
    • 5.9.4 Recent Developments
    • 5.9.5 SWOT Analysis
  • 5.10 STMicroelectronics N.V.
    • 5.10.1 Business Overview
    • 5.10.2 Products & Services
    • 5.10.3 Financials
    • 5.10.4 Recent Developments
    • 5.10.5 SWOT Analysis
  • 5.11 Infineon Technologies AG
    • 5.11.1 Business Overview
    • 5.11.2 Products & Services
    • 5.11.3 Financials
    • 5.11.4 Recent Developments
    • 5.11.5 SWOT Analysis
  • 5.12 Microchip Technology Inc.
    • 5.12.1 Business Overview
    • 5.12.2 Products & Services
    • 5.12.3 Financials
    • 5.12.4 Recent Developments
    • 5.12.5 SWOT Analysis
  • 5.13 ON Semiconductor Corporation
    • 5.13.1 Business Overview
    • 5.13.2 Products & Services
    • 5.13.3 Financials
    • 5.13.4 Recent Developments
    • 5.13.5 SWOT Analysis
  • 5.14 Texas Instruments Incorporated
    • 5.14.1 Business Overview
    • 5.14.2 Products & Services
    • 5.14.3 Financials
    • 5.14.4 Recent Developments
    • 5.14.5 SWOT Analysis
  • 5.15 Jiangsu Changjiang Electronics Technology Co., Ltd.
    • 5.15.1 Business Overview
    • 5.15.2 Products & Services
    • 5.15.3 Financials
    • 5.15.4 Recent Developments
    • 5.15.5 SWOT Analysis

• 6 Market Segmentation

  • 6.1 Ball Grid Array (BGA) Packaging Market, By Application
    • 6.1.1 Consumer Electronics
    • 6.1.2 Automotive
    • 6.1.3 Aerospace
    • 6.1.4 Medical Devices
    • 6.1.5 Industrial
  • 6.2 Ball Grid Array (BGA) Packaging Market, By Material Type
    • 6.2.1 Ceramic BGA
    • 6.2.2 Organic BGA
    • 6.2.3 Metal BGA
    • 6.2.4 Glass BGA
    • 6.2.5 Silicon BGA
  • 6.3 Ball Grid Array (BGA) Packaging Market, By Distribution Channel
    • 6.3.1 Direct Sales
    • 6.3.2 Distributors
    • 6.3.3 Online Retail

• 7 Competitive Analysis

  • 7.1 Key Player Comparison
  • 7.2 Market Share Analysis
  • 7.3 Investment Trends
  • 7.4 SWOT Analysis

• 8 Research Methodology

  • 8.1 Analysis Design
  • 8.2 Research Phases
  • 8.3 Study Timeline

• 9 Future Market Outlook

  • 9.1 Growth Forecast
  • 9.2 Market Evolution

• 10 Geographical Overview

  • 10.1 Europe - Market Analysis
    • 10.1.1 By Country
      • 10.1.1.1 UK
      • 10.1.1.2 France
      • 10.1.1.3 Germany
      • 10.1.1.4 Spain
      • 10.1.1.5 Italy
  • 10.2 Asia Pacific - Market Analysis
    • 10.2.1 By Country
      • 10.2.1.1 India
      • 10.2.1.2 China
      • 10.2.1.3 Japan
      • 10.2.1.4 South Korea
  • 10.3 Latin America - Market Analysis
    • 10.3.1 By Country
      • 10.3.1.1 Brazil
      • 10.3.1.2 Argentina
      • 10.3.1.3 Mexico
  • 10.4 North America - Market Analysis
    • 10.4.1 By Country
      • 10.4.1.1 USA
      • 10.4.1.2 Canada
  • 10.5 Middle East & Africa - Market Analysis
    • 10.5.1 By Country
      • 10.5.1.1 Middle East
      • 10.5.1.2 Africa
  • 10.6 Ball Grid Array (BGA) Packaging Market by Region

• 11 Global Economic Factors

  • 11.1 Inflation Impact
  • 11.2 Trade Policies

• 12 Technology & Innovation

  • 12.1 Emerging Technologies
  • 12.2 AI & Digital Trends
  • 12.3 Patent Research

• 13 Investment & Market Growth

  • 13.1 Funding Trends
  • 13.2 Future Market Projections

• 14 Market Overview & Key Insights

  • 14.1 Executive Summary
  • 14.2 Key Trends
  • 14.3 Market Challenges
  • 14.4 Regulatory Landscape

Segments Analyzed in the Report

The global Ball Grid Array (BGA) Packaging market is categorized based on

By Application

• Consumer Electronics
• Automotive
• Aerospace
• Medical Devices
• Industrial

By Distribution Channel

• Direct Sales
• Distributors
• Online Retail

By Material Type

• Ceramic BGA
• Organic BGA
• Metal BGA
• Glass BGA
• Silicon BGA

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Key Players

• Amkor Technology, Inc.
• ASE Group
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Texas Instruments Incorporated
• STMicroelectronics N.V.
• Infineon Technologies AG
• ON Semiconductor Corporation
• Microchip Technology Inc.
• Intel Corporation
• Rohm Semiconductor
• Broadcom Inc.
• Toshiba Corporation
• NEC Corporation
• GlobalFoundries Inc.
• NXP Semiconductors N.V.